Inika uluhlu olubanzi lwezixhobo eziphezulu ze-semiconductor ukuxhasa zonke izigaba zenkqubo yokuvelisa i-semiconductor. Ukusuka kwimveliso ye-wafer ukuya ekupakishweni, izixhobo zethu ziqinisekisa ukuchaneka, ukusebenza kakuhle kunye nokuthembeka, okwenza iinkampani zikwazi ukuhlangabezana neemfuno ezikhulayo zeshishini lombane.
Iimpawu Ukusebenza okugqwesileyo●UPH yonyuke ukuya kuthi ga kwi-30% ●Kwizicelo zocingo lobhedu lwesintu ●Ubungakanani bebhola ukuya kuthi ga kwi-22 μm ● Uyilo lobuNjineli obuchwepheshile lunciphisa idiameter yebhola ukuya kwi-22 μm ku-0.5mil wire dia...
Intshayelelo eneenkcukacha: ● Ukuhlolwa kokugqibela/inkqubo yokuhlela ene-6-side inspection, i-wafer yokuhlela kunye nokufumanisa ukuqhekeka kwecala ● Ii-wafers ezixhasayo: 6 ", 8", 12 "● Ubungakanani beChip: 0.4 * 0.2 -6 * 6mm; ubukhulu >...
Ubuninzi bobungakanani bobungakanani bomsebenzi mm ø200Ukusetyenzwa ngendlela ezenzekelayoX-i-axis esebenzayo yoluhlu lwesantya sokutya mm/s 1.0 - 1,000Y-i-axis yokubeka ukuchaneka mm ngaphakathi kwe-0.003/210Dimensions (WxDxH) mm 950 x 1,732 x 1,80...
Ubungakanani besixhobo: i-1.180 yeemitha ububanzi, i-1.080 yeemitha ubunzulu, i-1.820 yeemitha ukuphakama. Ubunzima besixhobo: malunga neekhilogram ze-1.500. Ubungakanani bobungakanani bento yokuqhubela phambili: Φ8 intshi (malunga ne-200 mm). Ubume be-Spindle...
Ukubekwa kwetshiphu ngokuthe ngqo ukusuka kwiwafer kwisixhobo esisezantsi sokukhwela umphezulu, ukudibanisa isantya soomatshini bokunyuka komphezulu kunye nokuchaneka koomatshini bokudibanisa itshiphu, ukutya okudityanisiweyo ngokuthe ngqo kwi-w...
Iiparitha zobugcisa: Iiparamitha zobugcisa bomshini we-ASM AA ziquka ubungakanani, ubunzima, amandla, isantya sokufumanisa kunye nesisombululo. Ezi parameters zinokunceda abasebenzisi bakhethe ezona zixhobo zifaneleka kakhulu ...
Iimpawu●Isixhobo sokupakisha esizimeleyo, esilungele zombini i-fack up and die down wafer level kunye ne-substrate package ●Ifanele i-KOZ kunye neemveliso ze-overmold ●Inokusebenzisa umgubo kunye ne-resin yokupakisha engamanzi. Au...
Ukulungiswa komatshini wocingo lweAluminiyam yinxalenye ephambili esetyenziswa kwi-ASMPT yomatshini wokudibanisa ucingo oluzenzekelayo kunye nomatshini wokufa. Isetyenziselwa ikakhulu ukulungisa kunye nokubeka ucingo lwe-aluminium ukuze kuqinisekiswe uzinzo kunye ...
I-ASMPT wire bonder spark rod isetyenziswa ikakhulu kwinkqubo yokuvelisa i-LED ukufezekisa ukuwelda kocingo lwegolide, ucingo lobhedu, i-alloy wire kunye nezinye imidiya ngokukhutshwa kwamandla ombane aphezulu. Intonga yentlantsi...
I-Asmpt ball bonder splitter idlala indima ebalulekileyo kwibala lokupakisha i-microelectronic kwaye isetyenziselwa ukusika ii-wafers ze-transistor kumatshini we-bonder yebhola.
Ukuqina kocingo lokubopha igolide kunokuhlengahlengiswa nge-doping ngezinto ezahlukeneyo, njengesilivere, i-palladium, i-magnesium, intsimbi, ubhedu, isilicon, njl.
Iimpawu zeSilver wireCheap: Ixabiso locingo lwesilivere limalunga nesinye kwisihlanu socingo lwegolide, olunika ixabiso elibalulekileyo inzuzo.I-conductivity enhle: I-Silver wire ine-conduc egqwesileyo...
I-Copper wire yinto eqhelekileyo yomqhubi, esetyenziswa ngokubanzi kwiingcingo, iintambo, iibrashi kunye nezinye iindawo, kwaye ithandwa ngenxa yokuqhuba kakuhle nokusebenza kwayo.
I-motherboard ye-die bonder yiyunithi yokulawula engundoqo ye-die bonder, enoxanduva lokusebenza kunye nokulungelelaniswa kwesixhobo sonke. Imisebenzi yayo ephambili ibandakanya: Ukulawula izenzo ezahlukeneyo ze-d...
Yinto ebalulekileyo yokuncedisa umatshini wokudibanisa i-ASM, ngokukodwa isetyenziselwa ukudibanisa umatshini wokudibanisa ucingo kunye nocingo lwe-welding ukuqinisekisa ukuzinza kunye nokusebenza kakuhle kwenkqubo ye-welding.
I-MRSI Systems Die Bonder yimveliso yeQela le-Mycronic, eligxile ekuboneleleni ngokuzenzekela ngokupheleleyo, ukuchaneka okuphezulu, iinkqubo eziguquguqukayo zokufa, ezisetyenziswa ngokubanzi kwi-optoelectroni...
I-Besi Datacon 8800 ngumatshini ophucukileyo we-chip bonding, osetyenziswa ikakhulu kwi-2.5D kunye ne-3D yeteknoloji yokupakisha, ngakumbi i-TSV (Nge-Silicon Via) izicelo.
I-KS MAXUM PLUS umatshini wokudibanisa ucingo ngumatshini wokubopha ucingo oluzenzekelayo oluzenzekelayo, olusetyenziselwa ukuwelda ngaphakathi kwe-diode ezikhupha ukukhanya, ii-transistors zamandla ezincinci naphakathi, ezidityanisiweyo...
I-Katalyst™ sisixhobo se-Flip Chip esinkqenkqeza phambili kushishino esaphehlelelwa nguKulicke & Soffa (K&S), ikakhulu esetyenziselwa ukupakishwa kwe-flip chip. Isixhobo sidibanisa ulawulo lwentshukumo kwi-hardware kunye ne-anti-vibration m...
I-KS Wire Bonder 8028PPS ngumatshini wokudibanisa ucingo oluzenzekelayo oluzenzekelayo, olusetyenziswa kakhulu kwintsimi yezixhobo zokupakisha ze-LED. Ineempawu zamandla aphezulu kwaye inokuphatha amandla aphezulu e-1W, i-3W epheleleyo...
Abaxhasi bethu bonke baphuma kwiinkampani ezinkulu ezichaziweyo ngokubanzi.
Iingqaku zobuchule ze SMT
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Izixhobo zeSemiconductor FAQ
MORE+Kwihlabathi elikhawulezileyo loqhagamshelwano lweelektroniki namhlanje, ukuhlala phambi komnqophiso kufuneka
I-Fuji smt mounter isetyenziswa kakhulu kumbane
Nangona nezixhobo eziqhubekileyo ezifuna ukugcina nokukhuthala okuqhelekileyo ukuqinisekisa ukusebenza kwexesha elide
KwiNkqubo yenkqubo yezenzo zeelektroniki, izixhobo zeSMT
KwiNkqubo yenkqubo yezenzo zeelektroniki, ukhetha umatshini okunene we SMT
Umqondiso weGeekvalue wokuphatha inqanawa kunye namava okuphakamisa umphantsi wakho kwiqondo elilandelayo.
Qhagamshelana nomngcipheko wokuthengisa
Phuma kwiqela lethu lokuthengisa ukukhangela izisombululo ezilungiselelweyo ezihlangana ngokupheleleyo iimfuno zakho zomsebenzi kwaye zilungisele nawuphi na imibuzo enokubakho.
© Zonke Amalungelo agcinwe. Inkxaso yobuchule:TiaoQingCMS
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