Provides a wide range of high-performance semiconductor equipment to support all stages of the semiconductor manufacturing process. From wafer manufacturing to packaging, our equipment ensures precision, efficiency and reliability, enabling companies to meet the growing needs of the electronics industry.
ASM sorting machine MS90 is a device designed for lamp bead sorting, with efficient and accurate sorting functions. This device is produced by ASM brand, model MS90, suitable for sorting LED lamp bead...
TRI ICT tester TR5001T is a powerful online tester, especially suitable for open and short circuit functional testing of FPC soft boards. The tester is small and lightweight, and can be easily connect...
TRI ICT tester TR518 SII is a comprehensive electronic test equipment, mainly used to detect the electrical performance of circuit boards to ensure that the quality of products meets the standards bef...
BESI's AMS-X mold machine is an advanced servo hydraulic molding machine with many advantages and features
BESI's MMS-X mold machine is a manual version of the AMS-X mold machine. It uses a newly developed plate press with an extremely compact and rigid structure to obtain a perfect, flash-free end p...
The FML function of the BESI molding machine is mainly used for precise control and management during the packaging and electroplating process.
The main function of BESI’s AMS-LM machine is to process large substrates and provide high productivity and good performance and output. The machine is capable of processing 102 x 280 mm substrates ...
AMS-i in BESI molding machine is an automated assembly and test system produced by BESI. BESI is a semiconductor and microelectronics manufacturing equipment company headquartered in the Netherlands...
AD420XL provides high-speed, high-precision pick and place Mini LED COB solutions for large-size LCD BLUs (for local dimming) and ultra-fine pitch LED displays, with small chip handling capabilities, ...
ASMPT's SD8312 fully automatic soft solder die bonder system is an advanced device designed for 12-inch wafer processing, with high-density lead frame processing capabilities and leading die bond...
The specifications and dimensions of the ASMPT fully automatic die bonding system are as follows:Dimensions: W x D x H 1,970 x 1,350 x 2,190 mm
The AD838l plus fully automatic disk bonding and flip chip system is a high-precision and high-efficiency die bonding equipment, mainly used for the automated production of semiconductor packaging an...
Features● New generation high-capacity AD8312 series die bonders set new standards for the industry● Universal worktable design, suitable for processing high-density lead frames● Available in multiple...
Features●Micro-pitch wire bonding capability, specialized in advanced packaging products●High-precision rotary welding head design●Zhuanli "PR on the Fly" function●Extremely large effective ...
Features●30% UPH improvement●Application based on typical copper wire●22μm solder ball●Expert skills, solder ball can be as small as 22μm in the case of 0.5mil line●High-end application of ultra-fine ...
Features● High-speed wire bonding capability● 1588 (128 lines) hourly capacity: 21,500+ lines● Double eight-shaped digital tube (16 lines): 14,500+ lines● Equipped with 4" diameter wire range to ...
Features●Accuracy ± 3 µm @ 3s●Glue dispensing/jetting for die bonding●Material source traceability for enhanced quality control●Patented soldering head design●Up to 8” x 8” substrate handling●Options●...
The Yamaha YSH20 flip chip mounter is a high-speed, high-precision mounter suitable for mounting a variety of components.
Features●Accuracy ± 12.5 µm @ 3s●Can directly process ceramic substrates●Masterful process and module design●Independent control of crystal retrieval and crystal bonding systems●Equipped with IQC syst...
Features●LED-specific high-speed wire bonding system●New hardware architecture, easy to maintain●High resolution of welding head, accuracy can reach 40nm●Innovative EFO cabinet adopts segmented spark ...
Our clients are all from large publicly listed companies.
SMT Technical Articles
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Semiconductor equipment FAQ
MORE+In today’s fast-paced world of electronics manufacturing, staying ahead of the competition requires
Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
Even the most advanced equipment requires regular maintenance and care to ensure long-term stable op
In the electronics manufacturing industry, SMT (Surface Mount Technology) equipment is an essential
In the electronics manufacturing industry, choosing the right SMT machine (Surface Mount Technology)
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