Provides a wide range of high-performance semiconductor equipment to support all stages of the semiconductor manufacturing process. From wafer manufacturing to packaging, our equipment ensures precision, efficiency and reliability, enabling companies to meet the growing needs of the electronics industry.
ACCRETECH Probe Station UF3000EX is an electrical signal detection device for each chip on each wafer, designed to ensure the quality of semiconductor products. The device uses next-generation technol...
ACCRETECH Probe Station AP3000 is a high-precision, high-efficiency, low-vibration, low-noise probe machine designed to achieve high-precision, high-throughput, low-vibration and low-noise performance...
Test Handler is an equipment that automates the final testing of semiconductor devices. It handles device transportation, controls temperature during semiconductor testing, and sorts devices based on ...
V93000 EXA Scale ArchitectureAll EXA Scale boards feature Advantest’s latest generation test processors, with eight cores per chip and unique features that accelerate test speed and simplify test exec...
KAIJO-FB900 is a fully automatic gold wire bonding machine, mainly used for gold wire bonding in the LED packaging production process
KS Wire Bonder 8028PPS is a fully automatic wire bonding machine, mainly used in the field of LED packaging equipment. It has the characteristics of high power and can handle high power 1W, 3W integr...
Katalyst™ is an industry-leading Flip Chip equipment launched by Kulicke & Soffa (K&S), mainly used for flip chip packaging. The device combines motion control on hardware and anti-vibration m...
KS MAXUM PLUS wire bonding machine is a fully automatic wire bonding machine, mainly used for internal lead welding of light-emitting diodes, small and medium-sized power transistors, integrated cir...
Besi Datacon 8800 is an advanced chip bonding machine, mainly used for 2.5D and 3D packaging technology, especially TSV (Through Silicon Via) applications
MRSI Systems Die Bonder is a product of the Mycronic Group, which focuses on providing fully automatic, high-precision, ultra-flexible die bonding systems, which are widely used in the optoelectroni...
It is an important accessory for ASM wire bonding machine, mainly used to connect the wire bonding machine and the welding wire to ensure the stability and efficiency of the welding process
The die bonder motherboard is the core control unit of the die bonder, responsible for the operation and coordination of the entire device. Its main functions include:Control various actions of the d...
Copper wire is a common conductor material, widely used in wires, cables, brushes and other fields, and is favored for its good conductivity and processing performance.
Characteristics of silver wireCheap: The price of silver wire is about one-fifth that of gold wire, which gives it a significant cost advantage.Good conductivity: Silver wire has excellent conduc...
The hardness of gold bonding wire can be adjusted by doping with different elements, such as silver, palladium, magnesium, iron, copper, silicon, etc., thereby changing its hardness, rigidity, ductili...
Asmpt ball bonder splitter plays an important role in the field of microelectronic packaging and is mainly used for cutting transistor wafers in ball bonder machines.
ASMPT wire bonder spark rod is mainly used in the LED production process to achieve the welding of gold wire, copper wire, alloy wire and other media through high voltage discharge. The spark rod is ...
Aluminum wire machine fixture is a key component used in ASMPT automatic wire bonding machine and die bonding machine. It is mainly used to fix and position aluminum wire to ensure the stability and a...
Features●Independent packaging equipment, suitable for both die up and die down wafer level and substrate packaging●Suitable for KOZ and overmold products●Can use powder and liquid packaging resin. Au...
Technical parameters: The technical parameters of the ASM AA machine include size, weight, power, detection speed and resolution. These parameters can help users choose the equipment that best suits ...
Our clients are all from large publicly listed companies.
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Semiconductor equipment FAQ
MORE+In today’s fast-paced world of electronics manufacturing, staying ahead of the competition requires
Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
Even the most advanced equipment requires regular maintenance and care to ensure long-term stable op
In the electronics manufacturing industry, SMT (Surface Mount Technology) equipment is an essential
In the electronics manufacturing industry, choosing the right SMT machine (Surface Mount Technology)
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