Provides a wide range of high-performance semiconductor equipment to support all stages of the semiconductor manufacturing process. From wafer manufacturing to packaging, our equipment ensures precision, efficiency and reliability, enabling companies to meet the growing needs of the electronics industry.
FeaturesExcellent performance●UPH increased by up to 30%●In traditional copper wire applications●Ball size up to 22 μm●Professional engineering design reduces ball diameter to 22 μm at 0.5mil wire dia...
Detailed introduction:● Final inspection/sorting system with 6-side inspection, wafer sorting and side crack detection● Support wafers: 6", 8", 12”● Chip size: 0.4*0.2 -6*6mm; thickness >...
Maximum workpiece size mm ø200Processing method Fully automaticX-axis effective feed speed range mm/s 1.0 - 1,000Y-axis positioning accuracy mm within 0.003/210Dimensions (WxDxH) mm 950 x 1,732 x 1,80...
Equipment size: 1.180 meters wide, 1.080 meters deep, 1.820 meters high. Equipment weight: about 1.500 kilograms. Maximum processing object size: Φ8 inches (about 200 mm). Spindle configurati...
Direct chip placement from the wafer on standard surface mount equipment, combining the speed of surface mount machines with the precision of chip bonding machines, integrated feed directly from the w...
Technical parameters: The technical parameters of the ASM AA machine include size, weight, power, detection speed and resolution. These parameters can help users choose the equipment that best suits ...
Features●Independent packaging equipment, suitable for both die up and die down wafer level and substrate packaging●Suitable for KOZ and overmold products●Can use powder and liquid packaging resin. Au...
Aluminum wire machine fixture is a key component used in ASMPT automatic wire bonding machine and die bonding machine. It is mainly used to fix and position aluminum wire to ensure the stability and a...
ASMPT wire bonder spark rod is mainly used in the LED production process to achieve the welding of gold wire, copper wire, alloy wire and other media through high voltage discharge. The spark rod is ...
Asmpt ball bonder splitter plays an important role in the field of microelectronic packaging and is mainly used for cutting transistor wafers in ball bonder machines.
The hardness of gold bonding wire can be adjusted by doping with different elements, such as silver, palladium, magnesium, iron, copper, silicon, etc., thereby changing its hardness, rigidity, ductili...
Characteristics of silver wireCheap: The price of silver wire is about one-fifth that of gold wire, which gives it a significant cost advantage.Good conductivity: Silver wire has excellent conduc...
Copper wire is a common conductor material, widely used in wires, cables, brushes and other fields, and is favored for its good conductivity and processing performance.
The die bonder motherboard is the core control unit of the die bonder, responsible for the operation and coordination of the entire device. Its main functions include:Control various actions of the d...
It is an important accessory for ASM wire bonding machine, mainly used to connect the wire bonding machine and the welding wire to ensure the stability and efficiency of the welding process
MRSI Systems Die Bonder is a product of the Mycronic Group, which focuses on providing fully automatic, high-precision, ultra-flexible die bonding systems, which are widely used in the optoelectroni...
Besi Datacon 8800 is an advanced chip bonding machine, mainly used for 2.5D and 3D packaging technology, especially TSV (Through Silicon Via) applications
KS MAXUM PLUS wire bonding machine is a fully automatic wire bonding machine, mainly used for internal lead welding of light-emitting diodes, small and medium-sized power transistors, integrated cir...
Katalyst™ is an industry-leading Flip Chip equipment launched by Kulicke & Soffa (K&S), mainly used for flip chip packaging. The device combines motion control on hardware and anti-vibration m...
KS Wire Bonder 8028PPS is a fully automatic wire bonding machine, mainly used in the field of LED packaging equipment. It has the characteristics of high power and can handle high power 1W, 3W integr...
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SMT:n tekniset artiklat
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Semiconductor equipment FAQ
MORE+Nykypäivän nopeatempoisessa elektroniikan valmistuksen maailmassa kilpailijoiden edellä pysyminen edellyttää
Fuji smt mounter on tehokas ja tarkka pintakiinnityslaite, jota käytetään laajalti sähkölaitteissa.
Jopa edistyneimmät laitteet vaativat säännöllistä huoltoa ja hoitoa pitkäaikaisen vakaan toiminnan varmistamiseksi
Elektroniikan valmistusteollisuudessa SMT (Surface Mount Technology) -laitteet ovat olennaisen tärkeitä
Elektroniikan valmistusteollisuudessa oikean SMT-koneen valitseminen (Surface Mount Technology)
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