DISCO ukuchaneka okuphezulu kwe-UV laser ukulungiswa

I-DISCO (eJapan DISCO) Uchungechunge lwe-ORIGAMI XP yinkqubo yokusika ye-laser ye-UV ephezulu echanekileyo eyenzelwe ngokukodwa ukusetyenzwa kwezinto ezinqabileyo ezifana nokupakishwa kwe-semiconductor, iibhodi zesekethe eziguquguqukayo ze-FPC, ii-wafers ze-LED, njl.

Ubude bobude: 355nm (i-ultraviolet), ukusetyenzwa okubandayo

Ukubekwa kokuchaneka: ±1μm (kunye neCCD yendawo yokubonwayo)

Isantya sokusika: ukuya kuthi ga kwi-500mm / s (kuxhomekeke kubukhulu bezinto eziphathekayo)

Ukususwa kothuli olukrelekrele: inkqubo edibeneyo yokuvuthela kwe-N2 kunye ne-electrostatic adsorption system

II. Ukuxilongwa kwempazamo eqhelekileyo kunye nezisombululo

1. Ukunciphisa amandla eLaser / ukungazinzi

Unobangela onokwenzeka:

Ukuguga kwe-ultraviolet laser crystal (Nd:YVO₄) (ubomi obumalunga ne-8,000-10,000 iiyure)

Ukungcoliswa komphezulu wekristale ephindwe kabini (LBO)

Ulungelelwaniso olubonakalayo (olubangelwa kukungcangcazela)

Amanyathelo okulungisa:

Ukubonwa kweSpectral:

Sebenzisa imitha yamandla ukulinganisa i-355nm imveliso, ukuthomalalisa>15% kufuna ulungelelwaniso lwendlela yokubona

Ukugcinwa kwekristale:

Coca ikristale ye-LBO ene-anhydrous ethanol + iswab yomqhaphu engenathuli (ungawuchukumisi umphezulu wokugquma)

Ulungelelwaniso lwendlela yokubona:

Sebenzisa ukulungiswa okukhethekileyo kweDISCO ukulungelelanisa i-engile yesibonisi (i-password yogunyaziso iyafuneka)

2. Ukusika i-drift yendawo (ukuchaneka okungaqhelekanga)

Iindawo zokukhangela eziphambili:

Ugxininiso lwekhamera yeCCD:

Coca ilensi kwaye wenze kwakhona ulungelelwaniso lwe "Auto-Focus".

Isikhokhelo seqonga leentshukumo:

Jonga impendulo ye-encoder motor (i-ERR 205 i-alam ixhaphakile)

Isixhobo sokufunxa isingxobo esisisigxina:

Isidanga sevacuum kufuneka sibe>80kPa (coca ikomityi yokufunxa ngeceramic ecocekileyo)

Indlela yokuqinisekisa ngokukhawuleza:

Sika ipateni yegridi esemgangathweni kwaye uthelekise ukutenxa phakathi komzobo woyilo kunye nendlela yokwenyani

3. Inkqubo ye-alarm code processing

Ikhowudi ye-alam Intsingiselo Ukusetyenzwa ngokuNgxamisekileyo

I-ALM 102 Iqondo lobushushu bentloko yeLaser liphezulu kakhulu Jonga ukuhamba kwamanzi okupholisa (kufuneka ube>2L/min)

I-ALM 303 Unxibelelwano lokhuseleko lubangelwe Qinisekisa ubume benzwa yocango olukhuselayo

I-ALM 408 Uxinzelelo lwenkqubo yokususa uthuli ayonelanga Buyisela isihluzi se-HEPA (rhoqo kwiiyure ezingama-500)

III. Isicwangciso solondolozo sothintelo

1. Ulondolozo lwemihla ngemihla

Coca inkunkuma eshiyekileyo kwindawo yokucubungula (ukuthintela i-electrostatic adsorption ekungcoliseni ifestile yamehlo)

Rekhoda idatha yamandla welaser (ukutshintshatshintsha kufuneka kube <±3%)

2. Ukugcinwa kwenyanga

Tshintsha amanzi okupholisa (i-conductivity <5μS/cm)

Lubricate X/Y axis rails (sebenzisa DISCO igrisi ekhankanyiweyo)

3. Ulondolozo olunzulu lonyaka

Ukuhlolwa okupheleleyo kwendlela ye-UV laser optical (isixhobo sokuqala sokulinganisa siyafuneka)

Ukutshintshwa kweoyile yempompo yokufunxa kunye nokuhlolwa kwesitywina

IV. Isicwangciso sokuphucula iindleko zogcino

1. Isicwangciso sokunciphisa iindleko zemodyuli yeLaser

Icandelo Ixabiso lokuqala lokubuyisela Isicwangciso esisesinye isilinganiselo sokulondoloza

Nd:YVO₄ crystal ¥180,000 Iqela lesithathu elihlaziyiweyo ikristale ¥80,000 55%

Iqela lelensi eziqwalaselayo ¥65,000 Ilensi yequartz edityanisiweyo yasekhaya ¥15,000 77%

Ikhadi lokulawula ukunyakaza ¥120,000 ukugcinwa kweChip-level ¥25,000 79%

2. Izakhono eziphambili

Ukwandisa ubomi beekristale laser:

Ukwehlisa ubushushu bokusebenza ukusuka kwi-25℃ ukuya kwi-20℃ kunokunyusa ubomi ngama-40%

Ukuqinisekiswa kwezinto ezityiwayo zasekhaya:

Izihluzi ze-HEPA, i-vacuum chucks, njl.njl. ziluphumelele uvavanyo lokuhambelana ne-DISCO

V. Amatyala aphumeleleyo

Iplanti yokupakisha yesemiconductor (5 ORIGAMI XPs)

Ingxaki:

Iindleko zonyaka zolondolozo zidlula ¥1,200,000, ngenxa yokutshintshwa rhoqo kweekristale zeUV.

Isisombululo sethu:

Faka imodyuli yokulawula ubushushu bekristale evaliweyo

Sebenzisa ukulungiswa kwe-laser yokupholisa endaweni yokutshintshwa kwekristale

Iziphumo:

Umjikelo wokutshintshwa kweCrystal wandiswa ukusuka kwiinyanga ezisi-8 ukuya kwiminyaka emi-3

Iindleko ezibanzi zonyaka zehlisiwe ukuya kwi-¥400,000

VI. Uxhaso lobuchwepheshe

Uluhlu lwezinto ezisetyenzisiweyo: Iimodyuli ze-UV zamehlo, iibhodi zokulawula intshukumo, njl.

Ukuxilongwa okude: Hlalutya iilogi zezixhobo ngokusebenzisa iqonga le-DISCO Connect

Fumana izisombululo zokulungisa ezilungiselelweyo

Qhagamshelana neengcali zethu zokugcina i-laser simahla:

"ORIGAMI XP Alarm Code Quick Reference Manual"

Ingxelo yezixhobo zakho zovavanyo lwezempilo

Ziqhelanise neenkonzo zendawo kunye nemigangatho yenkqubo yaseJapan ukuqinisekisa ukusebenza ngokufanelekileyo kunye nokuzinza kwezixhobo zokusika ezichanekileyo

—— DISCO isixhobo laser umboneleli ngenkonzo yokugcina eAsia Pacific