I-MFSC-1000 yi-1000W i-fiber laser eqhubekayo (CW). Umgaqo ongundoqo usekwe kwitekhnoloji yefiber laser, kwaye imveliso yamandla aphezulu iphunyezwa ngolwandiso lwamanqanaba amaninzi:
Impompo yomthombo wochulumanco
Sebenzisa i-semiconductor laser diode ephezulu yamandla (LD) njengomthombo wempompo ukukhupha i-808nm okanye i-915nm yobude bokukhanya.
Doped ifayibha amplification
Isibane sempompo zidityaniswa nefayibha ye-ytterbium-doped (Yb³⁺), kwaye ii-ion zomhlaba ezinqabileyo zifunxa amandla ukuvelisa i-1064~1080nm kufutshane nelaser ye-infrared.
I-Resonant cavity oscillation
I-resonant cavity yenziwa yi-fiber Bragg grating (FBG), ekhetha ubude obuthile kwaye ikhulise i-laser.
Imveliso yeBeam
Ekugqibeleni, kuphuma kwifayibha yokudlulisa (i-core diameter 50 ~ 100μm), kwaye indawo yoxinano oluphezulu lwenziwa emva kokugxila.
2. Imisebenzi engundoqo
Umsebenzi Ukufezekiswa kobugcisa Iimeko zesicelo
Imveliso ephezulu yamandla eqhubekayo 1000W imveliso ezinzileyo, amandla ahlengahlengiswayo (30% ~ 100%) Intsimbi yokusika ipleyiti etyebileyo (carbon steel ≤12mm)
Umgangatho ophezulu we-beam M²≤1.2 (kufutshane nemowudi enye), indawo encinci ekugxilwe kuyo (ububanzi malunga ne-0.1mm) Ukuwelda okuchanekileyo (iithebhu zebhetri, izixhobo zombane)
Izinto ezibonisa ukuchaneka okuphezulu Yandisa uyilo lokukhanya ukunciphisa ukubuya komonakalo wokukhanya ngexesha lokusetyenzwa kwemathiriyeli ebonakalisa kakhulu efana nobhedu kunye ne-aluminiyam yamandla amatsha ebhetri ukuwelda (ubhedu kunye ne-aluminiyam yesinyithi esahlukileyo)
Ulawulo lobukrelekrele Inkxaso yonxibelelwano lwe-RS485/MODBUS, iliso lokwenyani lamandla kunye nobushushu, i-alamu engaqhelekanga Ukudityaniswa komgca wemveliso ngokuzenzekelayo
Ukonga amandla kunye nokusebenza kakuhle kokuguqulwa kwe-Electro-optical ≥35%, ngaphezulu kwe-50% yokonga amandla xa kuthelekiswa neCO₂ laser Imveliso yokunciphisa iindleko zemveliso
3. Iimpawu zobugcisa
Uyilo lwemodyuli
Iimodyuli eziphambili ezifana nomthombo wempompo kunye nefiber optical zinokutshintshwa ngokukhawuleza ngexabiso eliphantsi lokugcinwa.
Ukhuseleko oluninzi
Ukushisa okungaphezulu, ukugqithisa, kunye nokubuyisela ukukhanya kokukhusela ukuqinisekisa ubomi bezixhobo (≥100,000 iiyure).
Ukuhambelana okubanzi
Ukulungelelaniswa kwiintlobo ezahlukeneyo zeentloko (ezifana neentloko zokusika, iintloko ze-welding) kunye neenkqubo zokulawula ukunyakaza (CNC, iingalo zerobhothi).
IV. Iimeko zesicelo eziqhelekileyo
Ukusika isinyithi: I-6mm yensimbi engenasici yokusika isantya esiphezulu (isantya ≥8m / min).
I-Welding: i-Busbar welding yeebhetri zamandla (i-spatter <3%).
Unyango lomphezulu: ukucocwa kwe-laser mold (ukususwa kwe-oxide layer ngaphandle komonakalo we-substrate).
V. Ukuthelekiswa kweenzuzo zokhuphiswano
IiParameters MFSC-1000 Ordinary 1000W laser
Umgangatho weBeam M²≤1.2 M²≤1.5
Ukusebenza kwe-Electro-optical ≥35% Ngokuqhelekileyo 25% ~ 30%
Ujongano lolawulo RS485/MODBUS+i-analog yobuninzi bolawulo lwe-analog kuphela
Iindleko zokugcina Uyilo lweModyuli, ukutshintshwa lula Kufuneka ubuyele kumzi-mveliso ukuze ulungiswe
VI. Iingcebiso zokukhetha
Ifanelekile: ukusika ipleyiti ephakathi kunye netyebileyo, i-welding ye-high-reflective material, i-automated line line line integration.
Iimeko ezingasebenziyo: ukuchaneka kwe-ultra-precision (ifuna i-picosecond/i-femtosecond laser) okanye ukusika okungeyontsimbi (njengeplastiki, umthi)