mpm umshicileli wesikrini

Iinkcukacha kunye neeparamitha zeMPM Momentum solder umshicileli wokuncamathisela zimi ngolu hlobo lulandelayo:

Ukuphathwa kweSubstrate:

Obona bukhulu bobungakanani besubstrate: 609.6mmx508mm (24”x20”)

Ubuncinane bobungakanani besubstrate: 50.8mmx50.8mm (2”x2”)

Ubunzima beSubstrate: 0.2mm ukuya ku-5.0mm (0.008” ukuya ku-0.20”)

Ubunzima besubstrate enkulu: 4.5kg (9.92lbs)

Umphetho wesubstrate ucoceko: 3.0mm (0.118”)

Ukukhutshwa okusezantsi: 12.7mm (0.5”) umgangatho, unokulungiselelwa ukuya kuma-25.4mm (1.0”)

I-Substrate clamping: Ukubambelela okuphezulu okulungisiweyo, i-vacuum yebhentshi, inkqubo ye-EdgeLoc edge clamping

Iindlela zenkxaso ye-substrate: i-vacuum yebhentshi, izikhonkwane zokukhupha imagnethi, izikhonkwane ze-vacuum ejector, iibhloko zenkxaso, ukulungiswa okukhethiweyo (isixhobo esincinci) okanye iGrid-Lok ekhethiweyo.

Iiparamitha zokuprinta:

Eyona ndawo yoshicilelo: 609.6mmx50 8mm (24"x20")

Ukukhutshwa koshicilelo: 0mm ukuya ku-6.35mm (0" ukuya ku-0.25")

Isantya sokushicilela: 0.635mm/sec ukuya ku-304.8mm/sec (0.025in/sec-12in/sec)

Uxinzelelo lokuprinta: 0 ukuya ku-22.7kg (0lb ukuya ku-50lbs)

Ubungakanani besakhelo sesakhelo sesakhelo: 737mmx737mm (29"x29").

Iimpawu zobuchwephesha: Ukuchaneka kolungelelwaniso kunye nokuphinda-phinda: ± 12.5 microns (±0.0005”) @6σ, Cpk≥2.0 Eyona nto i-solder paste yokuprinta isikhundla sokuphindaphinda ngokusekwe kuqinisekiso lwenkqubo yovavanyo lomntu wesithathu: ±20 microns (±0.0008”) @6σ, Cpk≥ 2.0 12 Ezinye izalathisi zobugcisa: Iimfuno zamandla: 200 ukuya 240VAC (±10%) isigaba esinye @50/60Hz, 15A Iimfuno zomoya oxinanisiweyo: 100 psi Ezi nkcukacha kunye neeparamitha zibonisa ubugcisa obucacileyo bomshicileli we-MPM Momentum solder paste, efanelekileyo kwiimfuno ezahlukeneyo zokwenziwa kombane.