en
id
sk
srp
swe
it
pt
ben
may
bel
nl
fra
th
vie
ru
jp
kor
de
arm
aze
bos
bul
bur
cs
dan
div
el
est
fil
fin
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
kan
kin
lao
lav
lit
ltz
lug
mao
mlt
nep
nor
nya
ori
orm
per
pl
rom
san
som
spa
swa
tam
tr
ukr
urd
wel
xho
I-VCTA-V850 sisikhangeli sobukhulu bokuncamathisela kwe-solder, esetyenziswa kakhulu ukubona ubukhulu bentlama ye-solder kunye nokuqinisekisa umgangatho wokwenziwa kwepetshi.
Imisebenzi kunye neendima
Imisebenzi ephambili yeVCTA-V850 ibandakanya:
Ukubona ubukhulu be-Solder paste: Ngokusebenzisa inkcazo ephezulu, iikhamera ezinesantya esiphezulu ezineelensi zetelecentric ekwibala eliphezulu, umlinganiselo ochanekileyo wobunzima be-solder paste uyaphunyezwa.
Ukudubula kwesakhelo esiphakamileyo: Itekhnoloji ye-GPU enkulu ehambelanayo isetyenziselwa ukuphucula isantya sokubala kunye nokubhaqa, kunye nokujongana ngempumelelo neengxaki ezifana ne-FPC warping.
Umboniso womfanekiso westereo onamacala amathathu: Inqanaba lobuchwephesha bokulinganisa iprofayile yokulinganisa (PMP) isetyenziselwa ukufumana imilo yento echanekileyo ephezulu kunye neziphumo zokulinganisa umthamo, kunye nokubonisa umbala wokwenyani wemifanekiso yestereo enamacala amathathu.
Iimodyuli ezisebenzayo ezahlukeneyo: Kubandakanya ukubonwa kweglue ebomvu, inkqubo yokufunda yebhodi engenanto, imbuyekezo yokugoba yebhodi ezenzekelayo, ukuqaphela ikhowudi yekhamera, ukucwangciswa kwe-intanethi kunye nokulungiswa kweengxaki kunye neminye imisebenzi.
Iiparamitha zobugcisa
Isisombululo sokubona: isisombululo se-8-bit grayscale, sifikelela kwisisombululo sokubhaqa se-0.37 microns.
Ukufumanisa amandla: Xa kuthelekiswa nokuchaneka komlinganiselo we-laser, ukuchaneka kuphuculwe ngemiyalelo ye-2 yobukhulu, obuphucula kakhulu amandla okubona kunye noluhlu lwesicelo sezixhobo.
Isiphumo sokubonisa: Ukusebenzisa i-RGB ephuhlisiwe yomthombo wokukhanya wemibala emithathu, i-3D kunye ne-2D imifanekiso yombala wenyani iyafezekiswa, kwaye umphumo wokubonisa usondele kakhulu kwinto yokwenyani.
Imeko yesicelo
I-VCTA-V850 ifanelekile kwintsimi ye-SMT patch processing, ngokukodwa kwindawo efuna ukubonwa kobukhulu be-solder. Inkcazo yayo ephezulu kunye nokuchaneka okuphezulu kwenza ukuba ibe noluhlu olubanzi lwamathemba okusebenza kwishishini lokuvelisa i-electronics
