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Imisebenzi ephambili kunye neziphumo ze-Mirtec SPI MS-11e ziquka le miba ilandelayo:
Ukubona ngokuchanekileyo okuphezulu: I-Mirtec SPI MS-11e ixhotyiswe ngekhamera ye-15-megapixel, enokufikelela kwi-3D ephezulu echanekileyo. Isisombululo sayo sobude sifikelela kwi-0.1μm, ukuchaneka kobude yi-2μm, kunye nokuphindaphinda ukuphakama yi-± 1%.
Imisebenzi yokufumanisa emininzi: Isixhobo sinokubona umthamo, indawo, ubude, ulungelelwaniso lwe-XY, kunye neebhulorho zokuncamathelisa i-solder. Ukongeza, inokubuyisela ngokuzenzekelayo imeko yokugoba ye-substrate ukuqinisekisa ukubhaqwa okuchanekileyo kwiiPCB ezigobileyo.
Uyilo oluphezulu lwe-optical: I-Mirtec SPI MS-11e yamkela ukuqikelelwa kabini kunye noyilo lwe-ripple yesithunzi, enokuphelisa isithunzi sokukhanya okukodwa kunye nokufezekisa iziphumo ezichanekileyo nezichanekileyo zovavanyo lwe-3D. Uyilo lwelensi yekhompawundi ye-telecentric iqinisekisa ukukhulisa rhoqo kwaye akukho parallax.
Utshintshiselwano lwedatha yexesha langempela: I-MS-11e inenkqubo ye-loop evaliweyo eyenza unxibelelwano lwexesha lokwenyani phakathi kwabashicileli/abakhweli, kwaye idlulise ulwazi malunga nendawo yokuncamathelisa i-solder komnye nomnye, ngokusisiseko ukusombulula ingxaki yokuprintwa kwe-solder emdaka kunye nokuphucula. umgangatho wemveliso kunye nokusebenza kakuhle.
Umsebenzi wokulawula kude: Isixhobo sinenkqubo yokudibanisa i-Intellisys eyakhelwe-ngaphakathi exhasa ulawulo olude, ukunciphisa ukusetyenziswa kwabasebenzi kunye nokuphucula ukusebenza kakuhle. Xa iziphene zenzeka kumgca, inkqubo inokuthintela kwaye ilawule kwangaphambili.
Uluhlu olubanzi lwezicelo: I-Mirtec SPI MS-11e ifanelekile kwi-SMT yokukhangela isiphene se-solder paste, ngakumbi kwishishini lokuvelisa i-electronics efuna ukuchongwa okuphezulu.
