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I-SAKI 3D SPI 3Si LS2 yinkqubo yokuhlola i-solder ye-3D ye-paste, eyona nto isetyenziselwa ukufumanisa umgangatho wokuprinta kwi-solder paste kwiibhodi zesekethe eziprintiweyo (PCBs).
Iimpawu eziphambili kunye neemeko zesicelo
I-SAKI 3Si LS2 inezi mpawu zilandelayo:
Ukuchaneka okuphezulu: Ixhasa izisombululo ezintathu ze-7μm, i-12μm kunye ne-18μm, ezifanelekileyo kwiimfuno zokubona ukuncamathisela kwe-solder ephezulu.
Inkxaso yefomathi enkulu: Ixhasa ubungakanani bebhodi yesekethe ukuya kuthi ga kwi-19.7 x 20.07 intshi (500 x 510 mm), ifanelekile kwiimeko ezahlukeneyo zesicelo.
Isisombululo se-Z-axis: Umsebenzi wokulawula intloko ye-Z-axis entsha unokuhlola amacandelo aphezulu, amacandelo e-crimped kunye ne-PCBA kwi-fixture, ukuqinisekisa ukufunyanwa ngokuchanekileyo kwamacandelo aphezulu.
Ukufunyanwa kwe-3D: Ixhasa iindlela ze-2D kunye ne-3D, kunye nobude obuphezulu bokulinganisa ubude ukuya kwi-40 mm, ifanelekile kumacandelo obunzima obunzima.
Iinkcukacha zobugcisa kunye neeparamitha zokusebenza
Iinkcukacha zobugcisa kunye neeparamitha zokusebenza ze-SAKI 3Si LS2 ziquka:
Isisombululo: 7μm, 12μm kunye ne-18μm
Ubungakanani bebhodi: Ubuninzi 19.7 x 20.07 intshi (500 x 510 mm)
Ubuninzi bobude bomlinganiselo wobude: 40 mm
Isantya sokubona: 5700 square millimeters ngomzuzwana
Ukuma kwemarike kunye novavanyo lomsebenzisi
I-SAKI 3Si LS2 ibekwe kwimarike njengeyona ndlela iphezulu yokuhlola i-3D ye-solder yokuhlola usetyenziso lwemizi-mveliso efuna ukuchongwa okuphezulu kokuchaneka. Uvavanyo lomsebenzisi lubonisa ukuba inkqubo yenza kakuhle ekubhaqweni ukuchaneka kunye nokusebenza kakuhle, kwaye inokuphucula kakhulu ukusebenza kwemveliso kunye nomgangatho wemveliso.
