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I-SPI TR7007SIII sisixhobo sokuhlola ukuprinta se-solder esichanekileyo esinezi mpawu zilandelayo kunye nemisebenzi:
Isantya sokuhlola: I-TR7007SIII inesantya sokuhlola ukuya kuthi ga kwi-200 cm²/sec, iyenza ibe yenye yezona matshini zikhawulezayo zokuhlola ukuprinta kwi-solder kushishino.
Ukuchaneka kohlolo: Isixhobo sibonelela ngohlolo olupheleleyo lwe-3D kunye nesisombululo ukuya kuthi ga kwi-10 µm, kwaye sinesisombululo sokuhlola esingenasithunzi esichanekileyo.
Iimpawu zobuchwephesha: I-TR7007SIII ixhotyiswe nge-loop function evaliweyo, iteknoloji ye-imaging ye-2D ephuculweyo, umsebenzi wembuyekezo webhodi ezenzekelayo kunye neteknoloji yokuskena ukukhanya komgca ukuqinisekisa iziphumo zokuhlolwa ezichanekileyo. Ukongeza, isixhobo sikwanazo zakhiwo ezimbini, eziphucula ngakumbi umthamo wemveliso.
I-interface yokusebenza: I-interface yokusebenza ye-TR7007SIII ilula kwaye inembile, kulula ukuyicwangcisa nokusebenza, kwaye inokuzisa ixabiso eliphezulu kumgca wemveliso.
Iimeko zesicelo:
Ukuhlolwa kokuchaneka okuphezulu: Kufanelekile kwishishini lokuvelisa i-elektroniki elifuna ukuhlolwa okuchanekileyo, ngokukodwa kwiimfuno ezingqongqo kwi-solder paste ubukhulu kunye nokufana ngexesha lenkqubo yokuvelisa.
Ukudityaniswa koMda woMveliso: Ngenxa yesantya esiphezulu kunye nobuchule bokubhaqa obusebenzayo, i-TR7007SIII inokudityaniswa ngokungenamthungo kwimigca yemveliso ekhoyo ukuze kuphuculwe ukusebenza kakuhle kwemveliso kunye nomgangatho wemveliso.
Ubume beMarike kunye nolwazi lweXabiso:
Ukuma kweMakethi: I-TR7007SIII ibekwe njengesixhobo sokukhangela esiphezulu, esifanelekileyo kubathengi abaneemfuno eziphezulu zokubona ukuchaneka kunye nokusebenza kakuhle.
Ulwazi lweXabiso: Ixabiso elithile lifuna ukubonisana ngokweemfuno zabathengi. Ngokuqhelekileyo ixabiso lezixhobo eziphezulu liya kuba liphezulu, kodwa ngokuqwalasela ukusebenza kwayo okuphezulu kunye neenzuzo zemveliso yexesha elide, imbuyekezo kwi-investment iphezulu.
