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I-PARMI Xceed 3D AOI eyona parameters zobugcisa ibandakanya:
Isantya sokuhlola: Esona santya siphezulu sokuhlolwa kweshishini yi-65cm²/sec, silungele indawo yokuhlola eyi-14 x 14umm.
Ixesha lokuhlola: Ixesha lokuhlola elisekelwe kwi-PCB 260mm (L) X 200mm (W) yimizuzwana eyi-10.
Itekhnoloji yomthombo wokukhanya: Itekhnoloji ye-laser ephindwe kabini yomthombo wokukhanya wokukhanya, ixhotyiswe nge-4-megapixel ephezulu-resolution lens ye-CMOS, umthombo wokukhanya we-RGBW we-LED kunye ne-telecentric lens.
Iimpawu zokuyila: Uyilo lwelaser olukhaphukhaphu kakhulu, uyilo olubambeneyo, ukubonelela ngemifanekiso yokwenyani ye-3D engenangxolo.
Ujongano lomsebenzisi: Ngokufana noyilo lwenkqubo yokuhlola yeSPI ekhoyo, kulula ukuyifunda nokusetyenziswa.
Umsebenzi weprogram: Umsebenzi weprogram yokucofa okukodwa, uvelisa ngokuzenzekelayo izinto zokuhlola ngokusebenzisa izicwangciso ze-ROI ezisisiseko, isekela ukuhlolwa kweentlobo ezininzi zeephene, kubandakanywa iindawo ezingekhoyo, i-pin warping, ubukhulu becandelo, i-component tilt, i-rollover, i-tombstone, i-reverse side, njl.
Ibhakhowudi kunye nokuqondwa kwamanqaku amabi: Ibhakhowudi kunye nokuqondwa kwamanqaku angalunganga kwenziwa ngaxeshanye ngexesha lenkqubo yokuhlola ukuphucula ukusebenza kakuhle kwemveliso.
Ezi parameters zobugcisa kunye nemisebenzi yenza i-PARMI Xceed 3D AOI igqwese kwintsimi ye-SMT (i-Surface Mount Technology), ekwazi ukufumanisa ngokufanelekileyo nangokuchanekileyo iintlobo ezahlukeneyo zeziphene, ezifanelekileyo kwizinto ezahlukeneyo ze-PCB kunye nonyango lomhlaba.
