I-DISCO ngokuPheleleyo ngokuSebenzayo ngokuDibana kweSaw DFD6341

I-DISCO DFD6341 umatshini wokudayela ozenzekelayo usetyenziselwa ikakhulu ukusetyenzwa kwe-semiconductor. Umatshini wokudayela we-DFD6341 wamkela indlela entsha ye-axis, eyandisa isantya sokubuya kwe-X ukuya kwi-1,000mm / sec, kwaye iphucula ukukhawuleza kunye nokunciphisa ukusebenza kwe-axis nganye. Uluhlu oluhambayo kwisantya esiphezulu luyanda, ngaloo ndlela luphucula kakhulu ukusebenza kwemveliso. Ukongezelela, iindawo ezisetyenzisiweyo ziphuculwe, isantya sokusingatha indlela yokuphatha eyona nto yanda, kwaye umgama phakathi kwee-spindles ufinyeziwe, onokunciphisa ixesha lokucubungula ngexesha lokusika kabini. Umatshini wokudayela we-DFD6341 ufanelekile kwimveliso enkulu. Isebenza ngokufanelekileyo kwaye ichanekile, kwaye inokuhlangabezana neemfuno zemveliso ephezulu kunye nokusebenza okuphezulu.

Ubungakanani besixhobo: i-1.180 yeemitha ububanzi, i-1.080 yeemitha ubunzulu, i-1.820 yeemitha ukuphakama. Ubunzima besixhobo: malunga neekhilogram ze-1.500. Ubungakanani bobungakanani bento yokuqhubela phambili: Φ8 intshi (malunga ne-200 mm). Ubume be-Spindle: i-spindles ephikisanayo emibini. Amandla alinganisiweyo: 1.2 kW kunye ne-2.2 kW. Isantya sokusika: 0.1 ukuya kwi-1,000 mm / sec. Uluhlu lokusika lwe-X-axis: 210 mm. Uluhlu lokusika lwe-Y-axis: 210 mm. I-Z-axis ehamba phambili yokuhamba: 19.22 mm (ye-Φ2-intshi ye-intshi) kunye ne-19.9 mm (ye-Φ3-intshi ye-intshi). Iiparamitha zobugcisa kunye neempawu zokusebenza kwe-X-axis isantya sokubuya: 1,000 mm / sec. Ukumisa ukuchaneka: 0.002 mm ngaphakathi koluhlu lwe-210 mm. Ukulinganisa isantya esiphezulu: Ixhotywe ngesibane se-xenon kunye ne-CCD ye-shutter ye-high-speed shutter, inokufikelela kwi-calibration ngexesha lokuhamba ngesantya esiphezulu, ukunciphisa ixesha lokulinganisa, kunye nokuphucula ukusebenza kakuhle kwemveliso.

Kulula ukusebenza: Isebenzisa i-graphical user interface (GUI) kunye ne-LCD touch screen ukuze isebenze kakuhle.

Iimeko zesicelo kunye neenzuzo

I-DISCO DFD6341 umatshini wokudayela ngokuzenzekelayo ulungele iimfuno zokusika ezichanekileyo kwimveliso ye-semiconductor. Ukusebenza kwayo okuphezulu kwemveliso kunye noyilo olugcina indawo lunika iingenelo ezibalulekileyo kwintsimi yokwenziwa kwe-semiconductor. Ngokulungisa amacandelo kunye nokwandisa isantya secandelo lokuphatha eliphambili, ixesha lokucutshungulwa kwe-double-axis cutting liyancitshiswa, ngakumbi ukuphucula ukusebenza kakuhle kwemveliso.