Umatshini wokusika we-DISCO wafer DFL7341

Umatshini wokusika we-DISCO we-wafer: Umatshini wokusika ongabonakaliyo we-DFL7341 we-laser ugxile kwi-laser ye-infrared ene-wavelength emalunga ne-1300nm ngaphakathi kwe-silicon wafer ukuvelisa umaleko oguquliweyo, kwaye emva koko ukwahlula isiqwenga kwiinkozo ngokwandisa ifilimu kunye nezinye iindlela zokufumana umonakalo ophantsi, ukuchaneka okuphezulu, kunye neziphumo zokusika ezikumgangatho ophezulu. Le ndlela yenza kuphela umaleko olungisiweyo ngaphakathi kwe-silicon wafer, icinezela ukuveliswa kwe-debris processing, kwaye ifanelekile kwiisampuli ezineemfuno eziphezulu ze-particle.

Ukuchaneka okuphezulu kunye nokusebenza okuphezulu: I-DFL7341 ithatha iteknoloji yokucoca eyomileyo, ayifuni ukucocwa, kwaye ifanelekile ukucubungula izinto ezinobunzima bokunganyangeki. Ububanzi be-groove yayo yokusika ingaba yincinci kakhulu, enceda ukunciphisa indlela yokusika. I-disk esebenzayo inokuchaneka okuphezulu, ukuchaneka komgca we-X-axis ngu-≤0.002mm/210mm, i-Y-axis yokuchaneka komgca ngu-≤0.003mm / 210mm, kunye ne-Z-axis yokuchaneka kokuchaneka ngu-≤0.001mm. Uluhlu lwesantya sokusika luyi-1-1000 mm / s, kwaye isisombululo se-dimensional yi-0.1 micron.

Ububanzi besicelo: Isixhobo sisetyenziselwa ukusika ii-wafers ze-silicon ezinobukhulu obungekho ngaphezu kwe-intshi ezi-8. Ilungele ukusika ii-wafers ezicocekileyo ze-silicon ezinobunzima obuyi-0.1-0.7mm kunye nobukhulu obuziinkozo obungaphezulu kwe-0.5mm. Amanqaku e-dicing emva kokusikwa malunga nee-microns ezimbalwa, kwaye akukho ngqungquthela yokudilika okanye umonakalo oncibilikayo kumphezulu kunye nomva we-wafer.

Iiparamitha zobuchwephesha: I-DFL7341 laser engabonakaliyo inkqubo yokusika iquka ukuphakanyiswa kwekhasethi, umthuthi, inkqubo yokulungelelanisa, inkqubo yokucubungula, inkqubo yokusebenza, isalathisi sesimo, i-injini ye-laser, i-chiller kunye nezinye iindawo. Isantya sokusika i-X-axis yi-1-1000 mm / s, isisombululo se-Y-axis dimensional yi-0.1 micron, kunye nesantya esihambayo si-200 mm / s; isisombululo se-Z-axis yi-0.1 micron, kunye nesantya esihambayo si-50 mm / s; Uluhlu lwe-Q-axis oluhlengahlengiswayo luyi-380 degrees.

Iimeko zesicelo: I-DFL7341 ifanelekile kwishishini le-semiconductor, ngakumbi kwinkqubo yokupakisha i-chip, enokuqinisekisa ukuchaneka kunye nokuzinza kwe-chip packaging, ukwandisa amandla okusebenza kwe-chip, kunye nokuphucula ukusebenza kakuhle kwemveliso. Isishwankathelo, umatshini wokusika we-DISCO DFL7341 udlala indima ebalulekileyo kwi-semiconductor kunye namashishini ombane. Ngokuchaneka kwayo okuphezulu kunye nobuchwepheshe bokusika obuphezulu, iqinisekisa umgangatho kunye nokusebenza kakuhle kwemveliso.