I-Semiconductor yokucoca umatshini we-chip packaging AC-420

Ukupakisha ngokupheleleyo umatshini we-semiconductor we-chip wokucoca kwi-intanethi luhlobo lwezixhobo ezenzelwe imboni yokupakisha i-chip. Isebenzisa iteknoloji yokucoca i-plasma ngokufanelekileyo nangokucokisekileyo ukususa ukungcola kwinkqubo yokupakisha i-chip ukuqinisekisa umgangatho kunye nokuthembeka kwe-chip.

Iimpawu zobugcisa kunye neendawo zokusetyenziswa

Ukupakisha ngokupheleleyo umatshini we-semiconductor we-chip ococekileyo kwi-intanethi wamkela itekhnoloji yokucoca ngokwasemzimbeni kwiplasma. Ngethuba lenkqubo yokucoca, i-plasma enamandla kakhulu inokubola ngokukhawuleza kwaye isuse ukungcola kwezinto eziphilayo kunye ne-inorganic ebusweni be-chip, kwaye ineempawu zokucoca ngokufanelekileyo, ukhuseleko kunye nokuthembeka, ukuzenzekelayo okuphezulu, ukonga amandla kunye nokukhuselwa kwendalo. Esi sixhobo sisetyenziswa ngokubanzi kwishishini lokupakisha i-semiconductor chip, kubandakanywa ukupakishwa kwesekethe edibeneyo, indibano yokupakisha i-chip kunye nezinye iinkalo.

Amathuba emarike kunye neendlela zophuhliso lwetekhnoloji

Ngophuhliso olukhawulezayo lweshishini le-semiconductor, iimfuno zomgangatho we-chip kunye nokuthembeka ziya zinyuka nangaphezulu, kwaye ukubaluleka koomatshini bokucoca kwinkqubo yokuvelisa i-chip kuya kuphawuleka ngakumbi. Amaziko ophando lwemakethi aqikelela ukuba imakethi yokupakishwa komatshini wokucoca iplasma kwi-intanethi iya kugcina izinga lokukhula eliphezulu kwaye ibe nethemba elibanzi lemarike. Kwixesha elizayo, izixhobo ziya kuba zihlakaniphile kwaye zizenzekelayo, kwaye ukusebenza kakuhle kokucoca kunye nokucoca umgangatho kuya kuphuculwa ngokuqhubekayo ukulungelelanisa utshintsho oluqhubekayo kwishishini le-semiconductor.