en
id
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arm
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bos
bul
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dan
div
el
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fil
fin
gle
glg
grn
heb
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hkm
hrv
hu
ice
kan
kin
lao
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mao
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I-motherboard ye-die bonder yiyunithi yokulawula engundoqo ye-die bonder, enoxanduva lokusebenza kunye nokulungelelaniswa kwesixhobo sonke. Imisebenzi yayo ephambili ibandakanya:
Lawula izenzo ezahlukeneyo ze-die bonder: ezinje ngokubekwa kwetshiphu, i-copper wire welding, ukubonwa kwe-solder joint, njl.
Ukusetyenzwa kwedatha kunye nonxibelelwano: Inkqubo yedatha evela kwi-sensor kunye ne-interfaces zokusebenza, kunye nokunxibelelana nezixhobo zangaphandle.
Inkqubo yokubeka imbonakalo: Qinisekisa ukuchaneka kwe-die bond ngokusebenzisa inkqubo yokubeka imbonakalo emibini.
Iinkcukacha zobugcisa kunye nezalathi zokusebenza ze-motherboard ye-die bonder zichaphazela ngqo uzinzo kunye nokusebenza kakuhle kwemveliso yezixhobo. Iimpawu eziphambili zobugcisa ziquka:
Isantya se-Welding: Isantya se-welding sichaphazela ngokuthe ngqo ukusebenza kwemveliso kwaye sisalathisi esibalulekileyo sokusebenza.
Umgangatho we-welding: Umgangatho we-welding umisela ukuthembeka kwe-chip.
Ukuzinza kwezixhobo: Ukuzinza kwezixhobo kuhambelana nokuzinza komgca wemveliso kunye nobomi bezixhobo.
