Iinkcukacha
Idayamitha: Idayamitha yocingo lwegolide oluyiqhina luqhele ukuba phakathi kwe-0.02 kunye ne-0.05 mm, kwaye ububanzi bocingo oluyi-ultra-fine lwegolide oludityanisiweyo lufikelele kwi-0.015 mm.
Ukubunjwa: Inxalenye ephambili yocingo lwegolide lwegolide, ngokucoceka kwe-99.999%, kwaye inokuthi ifakwe ngesilivere, i-palladium, i-magnesium, isinyithi, ubhedu, i-silicon kunye nezinye izinto.
Isicelo: I-Gold bonding wire isetyenziswa ngokubanzi kwi-teknoloji yokupakisha ye-semiconductor ye-bonding chip interfaces kunye ne-substrate interfaces.