Ukulungiswa komatshini we-aluminiyam we-ASMPT kubandakanya oku kulandelayo:
Isikhundla somatshini wokugaya: sisetyenziselwa ukubeka ngokukhawuleza i-workpiece ukuqinisekisa ukuchaneka kokulungiswa.
I-LED die bonding fixture: isetyenziselwa imisebenzi yokudibanisa ukufa ngexesha lokupakishwa kwe-LED ukuqinisekisa ukulungiswa okuchanekileyo kwee-chips ze-LED.
Ukulungiswa komatshini wokudibanisa i-wire: esetyenziselwa ukulungisa iingcingo ze-aluminiyam ngexesha le-welding ukuqinisekisa umgangatho we-welding.
Ezi zilungiso zihlala zichanekile eziphezulu kunye nomgangatho ophezulu, zifanelekile kwiimfuno zabathengi be-IC abaphezulu, kwaye zifanelekile kwiimeko zesicelo ezifana nokubopha ucingo.