Inika uluhlu olubanzi lwezixhobo eziphezulu ze-semiconductor ukuxhasa zonke izigaba zenkqubo yokuvelisa i-semiconductor. Ukusuka kwimveliso ye-wafer ukuya ekupakishweni, izixhobo zethu ziqinisekisa ukuchaneka, ukusebenza kakuhle kunye nokuthembeka, okwenza iinkampani zikwazi ukuhlangabezana neemfuno ezikhulayo zeshishini lombane.
Umatshini wokuhlela we-ASM i-MS90 sisixhobo esenzelwe ukuhlenga-hlengisa iintsimbi zesibane, esinemisebenzi esebenzayo nechanekileyo yokuhlela. Esi sixhobo siveliswe yi-ASM brand, imodeli ye-MS90, ilungele ukuhlela isibane sesibane se-LED...
Umvavanyi we-TRI ICT TR5001T ngumvavanyi onamandla we-intanethi, ofanelekileyo ngakumbi kuvavanyo olusebenzayo lwesekethe evulekileyo kunye neebhodi ezithambileyo ze-FPC. Umvavanyi mncinci kwaye ukhaphukhaphu, kwaye unokunxibelelana ngokulula...
Umvavanyi we-TRI ICT TR518 SII sisixhobo esibanzi sovavanyo lwe-elektroniki, esisetyenziswa kakhulu ukufumanisa ukusebenza kombane kwiibhodi zesekethe ukuqinisekisa ukuba umgangatho weemveliso uyahlangabezana nemigangatho...
Umatshini wokubumba we-BESI's AMS-X ngumatshini wokubumba we-servo hydraulic ophucukileyo oneengenelo ezininzi kunye neempawu
Umatshini wokubumba we-BESI we-MMS-X yinguqulelo yesandla yomatshini wokungunda we-AMS-X. Isebenzisa ipleyiti yokushicilela esandula ukuphuhliswa enesakhiwo esibambene ngokugqithisileyo nesiqinileyo ukufumana isiphelo esigqibeleleyo, esingenambane...
Umsebenzi we-FML womatshini wokubumba we-BESI usetyenziswa ikakhulu kulawulo oluchanekileyo kunye nolawulo ngexesha lokupakishwa kunye nenkqubo ye-electroplating.
Umsebenzi ophambili womatshini we-BESI we-AMS-LM kukucubungula ama-substrates amakhulu kunye nokubonelela ngemveliso ephezulu kunye nokusebenza kakuhle kunye nemveliso. Umatshini uyakwazi ukusetyenzwa 102 x 280 mm substrates ...
I-AMS-i kumatshini wokubumba we-BESI yindibano ezenzekelayo kunye nenkqubo yovavanyo eveliswa yi-BESI. I-BESI yinkampani ye-semiconductor kunye ne-microelectronics yokuvelisa izixhobo ezikomkhulu eNetherlands...
I-AD420XL ibonelela ngesantya esiphezulu, ukuchaneka okuphezulu kunye nokubeka izisombululo ze-Mini ze-LED COB zobukhulu obukhulu be-LCD BLUs (ye-dimming yendawo) kunye ne-ultra-fine pitch displays ye-LED, enobuchule obuncinci bokuphatha i-chip, ...
I-SD8312 ye-ASMPT's SD8312 ezenzekelayo ezenzekelayo ngokupheleleyo inkqubo ye-solder die bonder sisixhobo esiphucukileyo esenzelwe ukusetyenzwa kwe-wafer ye-intshi eyi-12, enobuchule obuphezulu bokwenza isakhelo kunye nebhondi ekhokelela ekufeni...
Iinkcazo kunye nemilinganiselo ye-ASMPT yenkqubo yokudibanisa ukufa ngokuzenzekelayo zezi zilandelayo: Imilinganiselo: W x D x H 1,970 x 1,350 x 2,190 mm
I-AD838l kunye ne-disk bonding ezenzekelayo ngokupheleleyo kunye ne-flip chip system sisixhobo se-bonding ephezulu esichanekileyo kwaye sisebenza ngokufanelekileyo, sisetyenziselwa imveliso ezenzekelayo yokupakishwa kwe-semiconductor...
Iimpawu ● Isizukulwana esitsha somthamo ophezulu we-AD8312 uthotho lwe-die bonders lumisela imigangatho emitsha kushishino ● uyilo olusetyenzwa ngokubanzi, olulungele ukusetyenzwa kwezakhelo zelothe ezinoxinano oluphezulu ● Ifumaneka kwiindawo ezininzi...
Iimpawu ●Isakhono sokudityaniswa kocingo oluncinci, olukhethekileyo kwiimveliso zokupakisha ezikwinqanaba eliphezulu ●Uyilo oluphezulu oluchanekileyo olujikelezayo lwe-welding ● Umsebenzi weZhuanli "PR on the Fly" ●Isebenza ngokugqithisileyo ...
Iimpawu ● 30% UPH uphuculo ● Usetyenziso olusekwe kucingo lwekopha oluqhelekileyo ● 22μm ibhola yesoda ● Izakhono zobuchwephesha, ibhola ye-solder inokuba ncinane njenge-22μm kwimeko yomgca we-0.5mil ● Ukusetyenziswa kwe-high-end ye-ultra-fine ...
Iimpawu ● Isantya esiphezulu sokubophelela ucingo ● 1588 (imigca eyi-128) umthamo weyure: 21,500+ imigca ● Iityhubhu yedijithali enemilo esibhozo (imigca eli-16): 14,500+ imigca ● Ixhotyiswe ngeengcingo eziyi-4" ububanzi ukuya ...
Iimpawu●Ukuchaneka ± 3 µm @ 3s●Ukukhupha iglu/ijetting ukwenzela ukuba kudityaniswe idie ●Imvelaphi yezinto ezilandelekayo zolawulo oluphuculweyo lomgangatho ● Uyilo lwentloko ethengiswayo enelungelo elilodwa lomenzi wechiza ● Ukuya kuthi ga ku-8” x 8” Ukuphathwa kwesubstrate ● Iinketho ●...
I-Yamaha YSH20 flip chip mounter yi-speed-speed, i-high-precision mounter ifanelekile ukuxhoma amacandelo ahlukeneyo.
Iimpawu●Uchaneka ± 12.5 µm @ 3s●Iyakwazi ukusetyenzwa ngokuthe ngqo ii-substrates ze-ceramic●Inkqubo egqwesileyo kunye noyilo lwemodyuli●Ulawulo oluzimeleyo lokubuyiswa kwekristale kunye neenkqubo zecrystal bonding ●Ixhotyiswe nge-IQC syst...
Iimpawu●Inkqubo ye-LED-specific high-speed high-speed wire bonding ●I-architecture entsha ye-hardware, kulula ukuyigcina ●Isisombululo esiphezulu sentloko ye-welding, ukuchaneka kunokufikelela kwi-40nm●Ikhabhinethi ye-EFO ehlaziyiweyo ithatha i-spark ecandiweyo ...
Abaxhasi bethu bonke baphuma kwiinkampani ezinkulu ezichaziweyo ngokubanzi.
Iingqaku zobuchule ze SMT
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Izixhobo zeSemiconductor FAQ
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I-Fuji smt mounter isetyenziswa kakhulu kumbane
Nangona nezixhobo eziqhubekileyo ezifuna ukugcina nokukhuthala okuqhelekileyo ukuqinisekisa ukusebenza kwexesha elide
KwiNkqubo yenkqubo yezenzo zeelektroniki, izixhobo zeSMT
KwiNkqubo yenkqubo yezenzo zeelektroniki, ukhetha umatshini okunene we SMT
Umqondiso weGeekvalue wokuphatha inqanawa kunye namava okuphakamisa umphantsi wakho kwiqondo elilandelayo.
Qhagamshelana nomngcipheko wokuthengisa
Phuma kwiqela lethu lokuthengisa ukukhangela izisombululo ezilungiselelweyo ezihlangana ngokupheleleyo iimfuno zakho zomsebenzi kwaye zilungisele nawuphi na imibuzo enokubakho.
© Zonke Amalungelo agcinwe. Inkxaso yobuchule:TiaoQingCMS
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