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Ukuchaneka okuphezulu okuzenzekelayo ngokupheleleyo kwi-AD280 ye-Die bonder yi-automated high-precision die bonder enezi mpawu zilandelayo kunye nemisebenzi:
Ukuma okuchanekileyo okuphezulu: I-AD280 Plus ineteknoloji yokuqaphela umfanekiso onelungelo elilodwa lomenzi, enokufikelela kwi-XY yokuchaneka kwe-±3 µm@3σ.
Izakhono zokuphatha izinto ezininzi: Isixhobo sixhasa ukuphatha izinto ezininzi, kubandakanywa ii-wafers kwi-expanders okanye i-clamping rings, iitreyi zefomati ozikhethelayo, i-Gelpak, i-tape feeders, njl.
Ukulandeleka: Ukuphucula ukulandeleka kwemveliso ngeebhakhowudi, iikhowudi zeQR okanye iteknoloji ye-OCR kwiiphaneli/iiwafers/iitshiphusi.
Die bond force control: Ixhotyiswe nge-sensor ye-die bond force, i-die bond force inokulawulwa ngokuchanekileyo.
Ukunyangwa ngokukhawuleza kwe-UV: Ixhasa ukunyangwa kwendawo kunye nokunyangwa kwephaneli, ilungele usetyenziso olunje ngePCB/COB yokupakisha i-transceiver.
Imimandla esebenzayo kunye namashishini
I-AD280 Plus ilungele izixhobo zokupakisha ze-IC, ngakumbi ukupakishwa okuphambili. Isetyenziswa ngokubanzi kwimveliso ye-semiconductor kunye neenkqubo zokupakisha, kwaye inokuphucula kakhulu ukusebenza kakuhle kokupakisha kunye nesivuno.
