en
id
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ben
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bel
nl
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vie
ru
jp
kor
de
arm
aze
bos
bul
bur
cs
dan
div
el
est
fil
fin
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
kan
kin
lao
lav
lit
ltz
lug
mao
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nep
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nya
ori
orm
per
pl
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spa
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wel
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Inkqubo ezenzekelayo ye-ASMPT die bonder ye-AD832I yi-digital ye-speed high-speed yesilivere yokucola i-die bonder eyenzelwe izixhobo ezincinci kwaye ikwazi ukuphatha iintlobo ngeentlobo zezixhobo ezifana ne-QFN, SOT, SOIC, SOP, njl. :
I-Ultra-micro micro dispensing capability: Iyakwazi ukuphatha ama-wafers amancinci, alungele ukuphatha isakhelo esikhokelayo.
Uyilo lwentloko ye-welding ye-patent: Uyilo lwentloko ye-welding ye-patent iphucula ukuzinza kunye nokusebenza kakuhle kwe-welding.
Inkqubo yokulahla iglue kabini: Ixhotyiswe ngenkqubo yokulahla iglue kabini, inokulawula ngcono ubungakanani kunye nokuchaneka kweglue esetyenzisiweyo.
Amanani omzobo exesha langempela: Inkqubo yamva nje ye-IQC ibonelela ngeenkcukacha-manani zexesha lokwenyani kubasebenzisi ukujonga nokulungelelanisa inkqubo yokuvelisa.
Ezi mpawu zenza i-AD832i iqhube kakuhle kwi-8-intshi (200 mm) inkqubo yokufa kwebhondi, ngokukodwa ifanelekileyo kwiindawo zokuvelisa ezifuna ukusebenza kakuhle kunye nokuchaneka okuphezulu.
