Semiconductor equipment
Fully automatic ASMPT soft tin die bonding machine system

Ukuzenzekela ngokupheleleyo inkqubo yomatshini wokudibanisa itoti ethambileyo ye-ASMPT

I-SD8312 ye-SD8312 ye-SD8312 ye-solder ethambileyo ezenzekelayo ezenzekelayo sisixhobo esiphambili esenzelwe ukusetyenzwa kwe-wafer ye-intshi eyi-12, enobuchule obuphezulu bokwenza isakhelo kunye nesantya esihamba phambili sokubopha. Inkqubo ifanelekile kwi-semicon yamandla

Ilizwe:Isetyenzisiwe i-stock:have Uvavanyo:
Iinkcukacha

Intshayelelo eneenkcukacha:

SD8312 oluzenzekelayo oluthambileyo inkqubo ASM die bonder inkqubo

Iimpawu

● Isizukulwana esitsha se-SD8312 siseta umgangatho omtsha we-12” ye-tin die bonder ethambileyo

● Uyilo olusebenzayo jikelele, olukwazi ukuphatha iifreyimu zelothe eziphezulu

● I-High-speed die bonder edibanisa ubuchule obutsha obuphezulu kunye neteknoloji yenkqubo evuthiweyo

● Ulawulo oluchanekileyo lwamanqanaba e-oksijini ngexesha lokudibanisa i-die

● Ubuchule bokwenza iwafer ye-AB

SD8312

Ulungile ukukhulisa umsebenzi wakho ngexabiso le Geekvalue?

Umqondiso weGeekvalue wokuphatha inqanawa kunye namava okuphakamisa umphantsi wakho kwiqondo elilandelayo.

Qhagamshelana nomngcipheko wokuthengisa

Phuma kwiqela lethu lokuthengisa ukukhangela izisombululo ezilungiselelweyo ezihlangana ngokupheleleyo iimfuno zakho zomsebenzi kwaye zilungisele nawuphi na imibuzo enokubakho.

Isicelo sokuthengisa

Elandelayo

Hlala unxulumano nathi ukuze ufumane iintshukumo ezidlulileyo, iinikezelo ezingaqhelekanga, nezihloko ezizakuphakamisa umsebenzi wakho kwiqondo elilandelayo.

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