I-ASM die bonder AD819 sisixhobo sokupakisha se-semiconductor ephucukileyo esetyenziselwa ukubeka ngokuchanekileyo iitshiphusi kwii-substrates kwaye sisixhobo esiphambili kwinkqubo yebhondi yokufa.
I-ASM die bonder AD819 sisixhobo sokupakisha se-semiconductor ephucukileyo esetyenziselwa ukubeka ngokuchanekileyo iitshiphusi kwii-substrates kwaye sisixhobo esiphambili kwinkqubo yebhondi yokufa.
AD819 Series Automatic ASMPT Die Bonding System
Iimpawu
●I-TO-ingakwazi ukupakisha ukupakisha ukusetyenzwa
● Ukuchaneka ± 15 µm @ 3s
● Inkqubo ye-Eutectic die bond (AD819-LD)
● Ukukhupha inkqubo yebhondi yokufa (AD819-PD)
Yandisa ubuchule kunye namava eGeekvalue ukunyusa uphawu lwakho luye kwinqanaba elilandelayo.
Qhagamshelana nengcali yokuthengisa
Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.
© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS
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