I-ASM die bonder AD819 sisixhobo sokupakisha se-semiconductor ephucukileyo esetyenziselwa ukubeka ngokuchanekileyo iitshiphusi kwii-substrates kwaye sisixhobo esiphambili kwinkqubo yebhondi yokufa.
I-ASM die bonder AD819 sisixhobo sokupakisha se-semiconductor ephucukileyo esetyenziselwa ukubeka ngokuchanekileyo iitshiphusi kwii-substrates kwaye sisixhobo esiphambili kwinkqubo yebhondi yokufa.
AD819 Series Automatic ASMPT Die Bonding System
Iimpawu
●I-TO-ingakwazi ukupakisha ukupakisha ukusetyenzwa
● Ukuchaneka ± 15 µm @ 3s
● Inkqubo ye-Eutectic die bond (AD819-LD)
● Ukukhupha inkqubo yebhondi yokufa (AD819-PD)
Umqondiso weGeekvalue wokuphatha inqanawa kunye namava okuphakamisa umphantsi wakho kwiqondo elilandelayo.
Qhagamshelana nomngcipheko wokuthengisa
Phuma kwiqela lethu lokuthengisa ukukhangela izisombululo ezilungiselelweyo ezihlangana ngokupheleleyo iimfuno zakho zomsebenzi kwaye zilungisele nawuphi na imibuzo enokubakho.
© Zonke Amalungelo agcinwe. Inkxaso yobuchule:TiaoQingCMS
en
id
sk
srp
swe
it
pt
ben
may
bel
nl
fra
th
vie
ru
jp
kor
de
arm
aze
bos
bul
bur
cs
dan
div
el
est
fil
fin
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
kan
kin
lao
lav
lit
ltz
lug
mao
mlt
nep
nor
nya
ori
orm
per
pl
rom
san
som
spa
swa
tam
tr
ukr
urd
wel
xho