SIPLACE Mounter-Siemens pick and place machine Specification Model SIPLACE X3S Technical Parameters

SIPLACE placement machine X series placement machine (ASM Siemens placement machine)

Siemens placement machine SIPLACE X3S

1, Machine features: SIPLACE X3 S

2, Number of cantilevers: 3

3, IPC speed: 78,100cph

4. SIPLACE benchmark evaluation: 94,500cph

5. Theoretical speed: 127,875cph

6. Machine size: 1.9x2.3m

7, Mounting head features: MultiStar

8, Component range: 01005-50x40mm

9. Mounting accuracy: ±41μm/3σ(C&P) ±34μm/3σ(P&P)

10. Angular accuracy: ±0,4°/3σ(C&P) ±0,2°/3σ(P&P)

11, the maximum component height: 11,5mm

12. Placement force: 1,0-10 Newton

13. Conveyor belt type: single track, flexible double track

14. Conveyor belt mode: asynchronous, synchronous

15, PCB format: 50x50mm-850x560mm

16, PCB thickness: 0,3-4,5mm (other sizes can be customized according to requirements)

17, PCB weight: maximum 3kg

18. Component supply and supply

19. Feeder capacity: 160 8mmX feeder modules

20. Feeder module type:

SIPLACE component trolley, SIPLACE matrix tray feeder (MTC), waffle tray (WPC5/WPC6),

JTF-S/JTF-MSIPLACE, X Feeder, Tray, Vibrating Tube, Vibrating Feeder, Customized OEM Feeder Module

21. Pickup rate: ≥99,95%

22, DPM rate: ≤3dpm

23. Illumination level: Level 6 illumination

24. Remarks: machine size, only for the main body of the equipment

PCB Format: Extended I/O rails allow board lengths up to 850 mm

The above is the introduction of Siemens chip mounter SIPLACE X3S brought to you by Xinling Industry!

Geekvalue Industry is an innovative technology enterprise whose main business is the full-chain intelligent service of placement machine equipment. 

We are based in Shenzhen, the core city of the Guangdong-Hong Kong-Macao Greater Bay Area, and have been working hard for more than ten years. 

With a professional team as the core and high-quality service as the guarantee, we deeply explore the industry pain points and user needs in the global 

patch machine field, and continue to explore and explore more professional market segments and cutting-edge technological innovation fields.