universal pick and place machine Fuzion

Tilmaamaha Qalabka Caalamiga ah ee Universal Fuzion Chip Mounter waa sida soo socota:

Saxnaanta Meelaynta iyo Xawaaraha:

Xaqiijinta Meelaynta: ± 10 micron saxnaanta ugu badan, <3 micron ku celcelin.

Xawaaraha Meelaynta: Ilaa 30K cph (30,000 wafers saacaddii) ee codsiyada korka korka ah iyo ilaa 10K cph (10,000 wafers saacaddii) ee baakadaha horumarsan.

Kartida Habaynta iyo Baaxadda Codsiga:

Nooca Chip: Waxay taageertaa jajabyo kala duwan oo ballaaran, jajabyo rogan, iyo cabbir buuxa oo wafer ah ilaa 300 mm.

Nooca Substrate: Waxa lagu dhejin karaa substrate kasta, oo ay ku jiraan filim, dabacsanaan, iyo looxyo waaweyn.

Nooca Quudinta: Noocyo kala duwan oo quudiye ah ayaa la isticmaali karaa, oo ay ku jiraan feedhiyeyaasha xawaaraha sare leh.

Tilmaamaha Farsamada iyo Hawlaha:

Saxeexa Sare ee Servo Driven Precision Heads: 14 saxan sare ah (mikroroon-hoosaad X, Y, Z) madax-doorasho-servo-driven.

Is-waafajinta Aragga: 100% hore u-door aragga iyo toosinta dhinta.

Bedelka hal-tallaabo: Hal-tallaabo wafer-to-uge beddelidda.

Habaynta xawliga sare leh: Dual wafers oo leh ilaa 16K wafers saacaddii (chip flip) iyo 14,400 wafers saacadiiba (aan lahayn chip flip).

Habaynta cabbirka weyn: Cabbirka farsamaynta substrate-ka ugu badan waa 635mm x 610mm, iyo cabbirka wafer-ka ugu badan waa 300mm (12 inji).

Kala duwanaansho: Waxay taageertaa ilaa 52 nooc oo chips ah, beddelka aaladda tooska ah (nozzle iyo biinanka ejector), iyo cabbirrada u dhexeeya 0.1mm x 0.1mm ilaa 70mm x 70mm.

Tilmaamahani waxay muujinayaan waxqabadka sare ee Universal Fuzion die mounter marka loo eego saxnaanta, xawaaraha iyo awooda farsamaynta, ku haboon noocyada kala duwan ee chip iyo substrate, iyo dabacsanaan sare