Semiconductor equipment

Qalabka semiconductor - Bogga2

Dulmarka Qalabka Semiconductor

Qalabka Semiconductor-ka ayaa lagama maarmaan u ah soo saarista iyo samaynta microchips-ka kuwaas oo xoojiya tignoolajiyada aan ku tiirsannahay maalin kasta. Mashiinadan horumarsan waxaa loogu talagalay inay soo saaraan aaladaha semiconductor, sida wareegyada isku dhafan, dareemayaasha, iyo microprocessors, kuwaas oo udub dhexaad u ah elektiroonigga casriga ah.

Waxay bixisaa tiro balaadhan oo ah qalab semiconductor waxqabadka sare si ay u taageeraan dhammaan marxaladaha geedi socodka wax soo saarka semiconductor. Laga soo bilaabo wax soo saarka wafer ilaa baakadaha, qalabkeenu wuxuu xaqiijiyaa saxnaanta, hufnaanta iyo isku halaynta, awood u siinaya shirkadaha inay daboolaan baahiyaha sii kordhaya ee warshadaha elektiroonigga ah.

  • ASMPT sorting machine MS90

    ASMPT mashiinka kala soocida MS90

    Mashiinka kala-soocidda ASM MS90 waa qalab loogu talagalay kala-soocidda laambada, oo leh hawlo kala-soocid hufan oo sax ah. Qalabkan waxaa soo saaray astaanta ASM, model MS90, oo ku habboon kala-soocidda laambada LED-ka

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  • TRI ICT tester TR5001T

    Tijaabada TRI ICT TR5001T

    Tijaabada TRI ICT TR5001T waa tijaabiye khadka tooska ah oo awood badan, gaar ahaan ku habboon tijaabinta shaqeynta furan iyo gaaban ee looxyada jilicsan ee FPC. Tijaabiyuhu waa mid yar oo miisaankiisu yar yahay, waxaana si fudud loogu xidhi karaa...

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  • ‌TRI ICT tester tr518 sii inline

    Tijaabada TRI ICT tr518 sii inline

    Tijaabada TRI ICT TR518 SII waa qalab imtixaan elektaroonik ah oo dhamaystiran, inta badan loo isticmaalo in lagu ogaado waxqabadka korantada ee looxyada wareegyada si loo hubiyo in tayada alaabadu ay buuxiso heerarka bef.

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  • besi molding machine ams-x

    besi mashiinka wax lagu dhejiyo ams-x

    Mashiinka caaryada ee BESI ee AMS-X waa mashiinka wax ka beddelka hydraulic ee servo oo horumarsan leh faa'iidooyin iyo astaamo badan

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  • besi molding machine‌ MMS-X

    mashiinka wax lagu dhejiyo ee besi MMS-X

    Mashiinka caaryada ee BESI ee MMS-X waa nooca gacanta ee mashiinka caaryada AMS-X. Waxay isticmaashaa saxan saxan cusub oo la sameeyay oo leh qaab-dhismeed aad u adag oo adag si ay u hesho dhammaystir dhammaystiran oo aan flash-ka lahayn.

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  • Fico Molding system FML

    Fico Molding nidaamka FML

    Shaqada FML ee mashiinka wax-qaabaynta ee BESI waxa inta badan loo adeegsadaa xakamaynta saxda ah iyo maaraynta inta lagu jiro habka baakooyinka iyo korantada.

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  • Fico Molding machine AMS-LM

    Fico Molding Machine AMS-LM

    Shaqada ugu weyn ee mashiinka AMS-LM ee BESI waa in uu farsameeyo substrate-ka waaweyn oo uu bixiyo wax soo saar sare iyo waxqabad wanaagsan iyo wax soo saar. Mashiinku wuxuu awood u leeyahay inuu farsameeyo 102 x 280 mm substrates ...

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  • Fico Molding machine AMS-i

    Fico Molding Machine AMS-i

    AMS-i oo ku jira mashiinka wax-qabashada ee BESI waa isku-uruurin iyo nidaam tijaabo ah oo ay soo saartay BESI. BESI waa semiconductor iyo shirkadda qalabka wax soo saarka ee microelectronics oo xarunteedu tahay Netherlands ...

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  • ASMPT Pacific Panel Welding

    ASMPT Welding Panel Pacific

    AD420XL waxay bixisaa xawaare sare, sax ah oo sax ah oo meeleyn mini LED COB xalalka LCD BLU-yada waaweyn (oo loogu talagalay hoos u dhigista maxalliga ah) iyo bandhigyo ultra-fiican oo LED ah, oo leh awood yar oo maarayn ah, ...

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  • Fully automatic ASMPT soft tin die bonding machine system

    Si toos ah oo toos ah ASMPT nidaamka mashiinka isku xidhka daasadda jilicsan

    ASMPT's SD8312 oo si buuxda otomaatig ah u ah nidaamka alxanka jilicsan ee dhinta waa qalab horumarsan oo loogu talagalay farsamaynta wafer-ka 12-inch, oo leh awoodo farsamayn jir-cufnaan sare leh iyo hogaaminta dammaanadda dhimashada

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  • Fully automatic ASMPT die bonding system AD832i

    Si toos ah oo toos ah ASMPT nidaamka isku xidhka AD832i

    Tilmaamaha iyo cabbirrada ASMPT si toos ah habka isku xidhka dhinta si toos ah waa sida soo socota: Cabirrada: W x D x H 1,970 x 1,350 x 2,190 mm

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  • Fully automatic die bonding and flip chip system AD838L plus

    Isku-xidhka dhinta si toos ah oo toos ah iyo nidaamka chip-ka roga AD838L oo lagu daray

    AD838l oo ay weheliso isku xidhka diskka oo si toos ah otomaatig ah u ah iyo nidaamka flip chip waa qalab isku xidhan oo sax ah oo heersare ah, oo inta badan loo isticmaalo soosaarka otomaatiga ah ee baakadaha semiconductor…

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  • ASMPT die bonding machine fully automatic system AD8312 Plus

    Mashiinka isku xidhka ee ASMPT dhinta si toos ah nidaamka AD8312 Plus

    Astaamaha • Jiilka cusub ee awoodda sare AD8312 taxanaha dhinta bonders waxay dejiyeen heerar cusub warshadaha • Naqshadaynta miiska shaqada ee caalamiga ah, oo ku habboon farsamaynta xargaha rasaasta cufnaanta sare • Waxaa laga heli karaa dhowr...

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  • ASMPT fully automatic wire bonding system AB589 series

    ASMPT si buuxda oo toos ah nidaamka isku xidhka silig AB589 taxane

    Features● Awood xidhidhiyaha siligga yar-yar, oo ku takhasusay baakadaha horumarsan ●Naqshadaynta madaxa alxanka wareega ee saxda ah ●Zhuanli "PR on the Fly" function ● Aad u weyn oo waxtar leh ...

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  • New ASMPT wire bonding machine technology AEROCAM Series

    Tignoolajiyada cusub ee mishiinka xidhidhiyaha siliga ASMPT AEROCAM Series

    Features● 30% UPH hagaajinta ● Codsiga ku saleysan silig naxaas ah ● 22μm kubbadda alxanka ● Xirfadaha khabiirada, kubbadda alxanka waxay noqon kartaa mid yar sida 22μm kiiska 0.5mil ● Codsiga dhamaadka-sare ee ultra-fine ...

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  • ASMPT automatic wire bonding machine Cheetah II

    ASMPT mashiinka isku xidhka siliga tooska ah ee Cheetah II

    Astaamaha ● Awood xidhidhiyaha siligga xawaaraha sare leh ● 1588 (128 xariiq) awooda saacadii: 21,500+ xariiq ● Laba jibbaar tuubo dhijitaal ah oo sideed qaabaysan (16 xariiq): 14,500+ xariiq • Ku qalabaysan 4" dhexroor silig ilaa ...

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  • ASMPT high-precision fully automatic die bonding machine AD280 Plus

    ASMPT-sax-sare oo dhammaystiran oo toos ah mashiinka isku xidhka dhinta AD280 Plus

    Astaamaha • Saxnaanta ± 3 µm @ 3s● Bixinta koollada ee isku xidhka dhinta ● Raadinta isha agabka ee xakamaynta tayada sare loo qaaday

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  • yamaha flip chip bonder YSH20

    Yamaha flip chip bonder YSH20

    Ku rakibida Yamaha YSH20 flip chip waa mid xawaare sare leh oo sax ah oo ku habboon in lagu rakibo qaybo kala duwan.

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  • ASMPT fully automatic eutectic machine AD211 Plus

    ASMPT mashiinka eutectic si buuxda otomaatig ah AD211 Plus

    Astaamaha • Saxnaanta ± 12.5 µm @ 3s●Waxay si toos ah u farsamayn kartaa substrates dhoobada ●Nidaamka heer sare ah iyo naqshadaynta cutubka ●Kontoroolka madax-banaan ee soo celinta crystal iyo hababka isku xidhka crystal ● Lagu qalabaysan yahay nidaamka IQC...

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  • ASMPT fully automatic wire bonding machine AB383

    ASMPT si buuxda oo toos ah mashiinka isku xidhka fiilada AB383

    Astaamaha • Nidaamka isku xidhka silig-xawaaraha sare ee gaarka ah ee LED ● Dhismaha qalabka cusub, fududahay in la ilaaliyo ●Xalka sare ee madaxa alxanka, saxnaanta waxay gaari kartaa 40nm● Golaha cusub ee EFO wuxuu qaataa dhimbiil qaybsan ...

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SMT Technical Articles and FAQ

Dhammaan macaamiisha waa shirkado waaweyn oo lagu magacaabay.

Technical Articles SMT

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Qalabka Semiconductor FAQ

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