ASM Die Bonder AD819 waa qalab baakad semiconductor ah oo horumarsan oo loo isticmaalo in si sax ah loogu dhejiyo chips substrates waana aalad muhiim u ah nidaamka dammaanadda dhimashada tooska ah
ASM Die Bonder AD819 waa qalab baakad semiconductor ah oo horumarsan oo loo isticmaalo in si sax ah loogu dhejiyo chips substrates waana aalad muhiim u ah nidaamka dammaanadda dhimashada tooska ah
AD819 Taxanaha Si Toos ah Si Toos ah u ah ASMPT Dhimashada Nidaamka
Astaamaha
●Awoodda farsamaynta baakadaha oo awood u leh
● Saxnaanta ± 15 µm @ 3s
Habka dammaanadda dhimista Eutectic (AD819-LD)
● Bixinta habka dammaanadda dhimista (AD819-PD)
Aqoonshaha iyo aqoonta xirfadda ee qoraalka la xiriira aad barato heerka soo socda.
La xiriir kharashka iibinta
Weydii kooxda iibsigayada si aad u baahan karto xalal caadi ah oo aad si qumman u buuxiso baahidaada ganacsiga islamarkaasna u baahan kartid su'aalaha aad haysatid.
© Dhammaan Xuquuqda Lacag. Kaalmada teknolojiga:TiaoQingCMS
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