mpm momentum screen printer

The specifications and parameters of the ‌MPM Momentum solder paste printer are as follows‌:

‌Substrate handling‌:

Maximum substrate size: 609.6mmx508mm (24”x20”)

Minimum substrate size: 50.8mmx50.8mm (2”x2”)

Substrate thickness: 0.2mm to 5.0mm (0.008” to 0.20”)

Maximum substrate weight: 4.5kg (9.92lbs)

Substrate edge clearance: 3.0mm (0.118”)

Bottom clearance: 12.7mm (0.5”) standard, configurable to 25.4mm (1.0”)

Substrate clamping: Fixed top clamping, bench vacuum, EdgeLoc edge clamping system

Substrate support methods: bench vacuum, magnetic ejector pins, vacuum ejector pins, support blocks, optional dedicated fixture (less tooling) or optional Grid-Lok‌

‌Printing parameters‌:

Maximum print area: 609.6mmx50 8mm (24"x20")

Printing release: 0mm to 6.35mm (0" to 0.25")

Printing speed: 0.635mm/sec to 304.8mm/sec (0.025in/sec-12in/sec)

Printing pressure: 0 to 22.7kg (0lb to 50lbs)

Template frame size: 737mmx737mm (29"x29") Optional adjustable template frame or smaller template size optional‌

‌ Technical indicators: Alignment accuracy and repeatability: ±12.5 microns (±0.0005”) @6σ, Cpk≥2.0 Actual solder paste printing position repeatability based on third-party test system verification: ±20 microns (±0.0008”) @6σ, Cpk≥2.0 12 Other technical indicators: Power requirements: 200 to 240VAC (±10%) single phase @50/60Hz, 15A Compressed air requirements: 100 psi These specifications and parameters show the detailed technical performance of the MPM Momentum solder paste printer, which is suitable for a variety of electronic manufacturing needs.