mpm momentum btb smt solder paste printer

The specifications and parameters of the ‌MPM Momentum BTB solder paste printer are as follows‌:

‌Substrate handling‌:

Maximum substrate size: 609.6mmx508mm (24”x20”)

Minimum substrate size: 50.8mmx50.8mm (2”x2”)

Substrate thickness: 0.2mm to 5.0mm (0.008” to 0.20”)

Maximum substrate weight: 4.5kg (9.92lbs)

Substrate edge clearance: 3.0mm (0.118”)

Bottom clearance: 12.7mm (0.5”) standard, configurable to 25.4mm (1.0”)

Substrate clamping: Fixed top clamp, table vacuum, EdgeLoc (edge lock) (option)

Substrate support methods: Table vacuum, magnetic ejector pins, vacuum ejector pins, support blocks, dedicated fixtures (less tooling) or Grid-Lok (option)

‌Printing parameters‌:

Maximum print area: 609.6 mmx508mm (24"x20")

Print release: 0mm to 6.35mm (0" to 0.25")

Print speed: 0.635mm/sec to 304.8mm/sec (0.025in/sec to 12in/sec)

Print pressure: 0 to 22.7kg (0lb to 50lbs)

Stencil frame size: 737mmx737mm (29"x29") Smaller stencils available

Fiducial type: Standard shape fiducials (SMEMA compliant), pads/openings

Camera system: Single digital camera, MPM patented up/down vision system

Alignment accuracy and repeatability: ±12.5 microns (±0.0005") @6σ, Cpk ≥ 2.0*

Actual solder paste print position repeatability: ±20 microns (±0.0008") @6σ, Cpk ≥ 2.0*

Cycle time: Momentum 9 seconds standard for BTB, 7.5 seconds standard for Momentum HiE BTB

Power requirement: 200 to 240VAC (±10%) single phase @50/60Hz, 15A

Compressed air requirement: 100 psi‌

These specifications and parameters show the detailed technical indicators and performance data of the MPM Momentum BTB solder paste printer, which is suitable for a variety of electronic manufacturing needs.