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Key features of EKRA X5 include high flexibility and excellent throughput. It adopts patented Optilign multi-substrate alignment technology and is able to handle small, complex, and odd-shaped designed substrates or SiP (system-in-package) module solutions, ensuring high-precision and efficient production. In addition, X5 also has the following specific features:
High flexibility and multi-substrate handling capabilities: The X5 is able to manage up to 50 individual substrates within a tooling fixture, significantly increasing production efficiency and flexibility.
Reduce cleaning cycle: Since the cleaning cycle depends on the number of printings, X5’s Optilign technology reduces the number of wipes. Each wipe is equivalent to processing the previous N substrates, thus reducing downtime.
Multi-Carrier Function: Optilign Multi-Carrier function allows more substrates to be processed in one operation, increasing throughput by nearly 3 times without the need to replace larger carriers.
[I/O system upgrade: and stability.
High-speed servo vision drive system: The use of high-speed servo vision drive system reduces the system temperature gradient and maintains process stability.
These features make EKRA
