parmi spi hs70 smt machine

PARMI solder paste inspection machine SPI HS70 is a new generation of solder paste inspection equipment launched by PARMI, mainly used in the field of 3D precision inspection. The equipment combines PARMI's rich experience and advanced technology in inspection technology. It is particularly worth mentioning that it is equipped with RSC_6 Sensor, which greatly shortens the inspection time. It also uses two RSC Sensors with lens magnifications of 0.42 times and 0.6 times, which can be adjusted according to product characteristics to optimize speed and accuracy.

Technical specifications and functional features

Inspection method: SPI HS70 adopts a linear motor scanning inspection method to avoid unnecessary vibration during the inspection process, making the machine more stable during the inspection process and extending the hardware life of the machine.

Stop mechanism: The "Down clamping" design makes the substrate more stable in the stop position and improves the accuracy of the inspection.

Track design: The design of SPI HS70D Dual Lane supports 2, 3, and 4 track width adjustments, and can specify 1, 3 or 1, 4 track fixation, which enhances the flexibility and stability of the machine

The technical parameters of PARMI-SPI-HS70 are as follows:

Size: 430x350mm, thickness 4mm, weight 800kg. Resolution: 20x10um resolution speed is 80cm²/sec, 13x7um resolution speed is 40cm²/sec. Detection capability: It can detect ultra-small solder pads, such as 100um solder pads. Detection method: It uses linear motor scanning detection, which will not cause unnecessary vibration during the process, ensuring the stability of the machine. Maintenance convenience: All motor cables are in the sliding drawer box in the front, which is convenient for maintenance and maintenance, and maintenance operations can be carried out while the machine is running. Dual-track design: It supports 2, 3, and 4 track designs, and the track width can be adjusted, which is suitable for different production line layouts. These technical parameters show that PARMI-SPI-HS70 is a high-performance solder paste detection equipment suitable for high-precision production needs.