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The main functions and effects of Mirtec SPI MS-11e include the following aspects:
High-precision detection: Mirtec SPI MS-11e is equipped with a 15-megapixel camera, which can achieve high-precision 3D detection. Its height resolution reaches 0.1μm, height accuracy is 2μm, and height repeatability is ±1%.
Multiple detection functions: The device can detect the volume, area, height, XY coordinates, and bridges of solder paste. In addition, it can automatically compensate for the bending state of the substrate to ensure accurate detection on curved PCBs.
Advanced optical design: Mirtec SPI MS-11e adopts dual projection and shadow ripple design, which can eliminate the shadow of a single light and achieve precise and accurate 3D testing effects. Its telecentric compound lens design ensures constant magnification and no parallax.
Real-time data exchange: The MS-11e has a closed loop system that enables real-time communication between printers/mounters, and transmits information about the location of solder paste to each other, fundamentally solving the problem of poor solder paste printing and improving production quality and efficiency.
Remote control function: The device has a built-in Intellisys connection system that supports remote control, reduces manpower consumption and improves efficiency. When defects occur in the line, the system can prevent and control them in advance.
Wide range of applications: Mirtec SPI MS-11e is suitable for SMT solder paste defect detection, especially for the electronics manufacturing industry that requires high-precision detection
