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The SPI TR7007SIII is a high-precision solder paste printing inspection device with the following main features and functions:
Inspection speed: The TR7007SIII has an inspection speed of up to 200 cm²/sec, making it one of the fastest solder paste printing inspection machines in the industry.
Inspection accuracy: The device provides full 3D inspection with a resolution of up to 10 µm, and has a high-precision inline shadow-free inspection solution.
Technical features: The TR7007SIII is equipped with a closed loop function, enhanced 2D imaging technology, automatic board bending compensation function and stripe light scanning technology to ensure high-precision inspection results. In addition, the device also has a dual-track architecture, which further improves the production line's capacity.
Operation interface: The TR7007SIII's operation interface is simple and intuitive, easy to program and operate, and can bring maximum value to the production line.
Application scenarios:
High-precision inspection: Suitable for the electronic manufacturing industry that requires high-precision inspection, especially for strict requirements on solder paste thickness and uniformity during the production process.
Production Line Integration: Due to its high speed and efficient detection capabilities, TR7007SIII can be seamlessly integrated into existing production lines to improve overall production efficiency and product quality.
Market Positioning and Price Information:
Market Positioning: TR7007SIII is positioned as a high-end detection equipment, suitable for customers with high requirements for detection accuracy and efficiency.
Price Information: The specific price needs to be consulted according to customer needs. Usually the price of high-end equipment will be relatively high, but considering its high performance and long-term production benefits, the return on investment is higher
