en
id
sk
tr
srp
swe
it
pt
nor
ben
may
bel
nl
fra
th
vie
ru
jp
kor
de
hi
Key features and functions of the Essa Reflow Oven HOTFLOW 3-20 include:
Efficient heat transfer and low energy consumption : The Essa Reflow Oven HOTFLOW 3-20 uses Essa's patented heating technology to achieve excellent heat transfer with minimal energy and nitrogen consumption. Low energy operation is achieved through intelligent energy management.
Multi-stage cooling system : The equipment is equipped with multi-stage controllable cooling, providing cooling steps from the top and bottom, and cooling zone temperature monitoring to ensure efficient temperature control.
Modular design : ERSA Process Control (EPC) and Ersa Autoprofiler software are used to instantly find temperature profiles, improving equipment availability and ease of maintenance. The heating and cooling modules are retractable without any tools.
Efficient production capacity : With double to quadruple conveyor options, the HOTFLOW 3-20 can achieve amazing throughput growth without increasing the footprint. With up to four conveyor speeds and precisely adjusted conveyor widths, the system can process a wide range of components. High-quality welding: The equipment adopts multi-point nozzle technology, which has good temperature uniformity and high heat transfer efficiency. The track is designed to be vibration-free throughout the whole process to ensure welding quality and prevent disturbance of solder joints.
Multiple cooling configurations: HOTFLOW 3-20 provides multiple cooling solutions such as air cooling, ordinary water cooling, enhanced water cooling and super water cooling to meet the cooling needs of different circuit boards and avoid misjudgment caused by high PCB board temperature.
Maintenance convenience: The equipment is equipped with a multi-level flux management system, which provides multiple management methods such as water-cooled flux management, medical stone condensation + adsorption, and flux interception in specific temperature zones, supplemented by a pull-out design of the heating/cooling nozzle plate for easy maintenance.
Energy-efficient welding: Closed-loop control is adopted to weld circuit boards with high energy efficiency to ensure high-quality welding results.
Application scenarios and user reviews:
Essar reflow oven HOTFLOW 3-20 is suitable for the welding of various flat modules, especially for reflow soldering of circuit boards with large heat capacity. It performs well in emerging industries such as 5G communications and new energy vehicles, and can meet the needs of high-volume production. Users comment that it has stable performance, easy maintenance, and is suitable for large-scale production environments.
