sony si-g200 pick and place machine

The specifications of Sony SMT machine SI-G200 are as follows:

Machine size: 1220mm x 1850mm x 1575mm

Machine weight: 2300KG

Equipment power: 2.3KVA

Substrate size: minimum 50mm x 50mm, maximum 460mm x 410mm

Substrate thickness: 0.5~3mm

Applicable parts: standard 0603~12mm (moving camera method)

Placement angle: 0 degrees~360 degrees

Placement accuracy: ±0.045mm

Installation rhythm: 45000CPH (0.08 seconds moving camera/1 second fixed camera)

Number of feeders: 40 on the front side + 40 on the rear side (80 in total)

‌Feeder type‌: 8mm wide paper tape, 8mm wide plastic tape, 12mm wide plastic tape, 16mm wide plastic tape, 24mm wide plastic tape, 32mm wide plastic tape (mechanical feeder)

‌Placement head structure‌: 12 nozzles/1 placement head, 2 placement heads in total

‌Air pressure‌: 0.49~0.5Mpa

‌Air consumption‌: about 10L/min (50NI/min)

‌Substrate flow‌: left→right, right←left

‌Transport height‌: standard 900mm±30mm

‌Using voltage‌: three-phase 200V (±10%), 50-60HZ‌12

Technical features and application scenarios

Sony's placement machine SI-G200 is equipped with two new high-speed planetary patch connectors and a newly developed multi-functional planetary connector, which can increase production capacity more quickly and precisely. Its small size, high speed and high precision can meet the needs of various electronic component assembly production lines. The double planetary patch connector can achieve a high production capacity of 45,000 CPH, and the maintenance cycle is 3 times longer than previous products. In addition, its low power consumption rate is suitable for high production capacity and space saving needs.