sony sl-f130 placement machine

Sony SI-F130 is an electronic component placement machine, mainly used in the electronics manufacturing industry for efficient and precise mounting of electronic components. ‌

Functions and Features ‌High-precision mounting‌: SI-F130 is equipped with high-precision large substrates, supporting a maximum LED substrate size of 710mm×360mm, suitable for substrates of various sizes‌. ‌Efficient production‌: The equipment can mount 25,900 components per hour under specified conditions, suitable for large-scale production needs‌. ‌Versatility‌: Supports a variety of component sizes, including 0402-□12mm (mobile camera) and □6mm-□25mm (fixed camera) within 6mm in height‌. ‌Intelligent experience‌: Although SI-F130 itself does not include AI functions, its design focuses on rapid implementation and traceability, suitable for environments that require efficient production‌. ‌ Technical parameters

‌Installation speed‌: 25,900 CPH (conditions specified by the company)‌

‌Target component size‌: 0402-□12mm (mobile camera), □6mm-□25mm (fixed camera) within 6mm in height‌

‌Target board size‌: 150mm×60mm-710mm×360mm‌

‌Head configuration‌: 1 head/12 nozzles‌

‌Power supply requirements‌: AC3 phase 200V±10% 50/60Hz 1.6kVA‌

‌Air consumption‌: 0.49MPa 0.5L/min(A.N.R)‌

‌Dimensions‌: W1,220mm×D1,400mm×H1,545mm (excluding signal tower)‌

‌Weight‌: 1,560kg‌

Application scenarios

Sony SI-F130 is suitable for production environments that require efficient and precise electronic component installation, especially for large-scale production and scenarios that require high-precision installation