Siemens SMT HS60 is a modular SMT machine that combines ultra-high speed, ultra-precision and flexibility, and is particularly suitable for high-speed and high-precision placement of small components. The following are its detailed technical parameters and functional features:
Technical parameters
Placement head type: 12 nozzle collection placement head
Number of cantilevers: 4
Placement range: 0201 to 18.7 x 18.7 mm²
Placement speed: Theoretical value 60,000 pieces/hour, actual experience value 45,000 pieces/hour
Material rack support: 144 8mm material strips
Placement accuracy: ±75μm under 4sigma
Applicable substrate: Single track maximum 368x460mm, minimum 50x50mm, thickness 0.3-6mm
Power: 4KW
Compressed air requirements: 5.5~10bar, 950Nl/min, pipe diameter 3/4"
Operating system: Windows / RMOS
Single track/dual track optional
Functional features
High-speed placement: The HS60 placement machine has ultra-high-speed placement capabilities, with a theoretical placement speed of up to 60,000 pieces/hour, suitable for large-scale production needs.
High-precision placement: The placement accuracy reaches ±75μm under 4sigma, ensuring high-precision component placement.
Modular design: The HS60 adopts a modular design, which is easy to maintain and upgrade, and improves the flexibility and scalability of the equipment.
Wide range of applications: Suitable for a variety of component types, including resistors, capacitors, BGA, QFP, CSP, etc.
Application scenarios
The Siemens HS60 placement machine is suitable for various electronic manufacturing scenarios, especially in SMT production lines that require high-speed and high-precision placement. Its modular design enables the equipment to adapt to different production needs and is suitable for large-scale production and placement of precision components