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Product description:
PHILIPS placement machine HYbrid3 has been committed to providing customers with market-leading packaging solutions for decades. In recent years, PHILIPS has added advanced packaging, electronic assembly, wedge welding machines and other products through strategic acquisitions and independent research and development. At the same time, it has further expanded the product range of consumables in conjunction with its core products. Combining its rich industry expertise, strong process technology and R&D capabilities, Kulisofa will wholeheartedly help customers meet the challenges of next-generation electronic component packaging.
Features:
Highest accuracy: ±7μm placement accuracy
Minimum component: minimum mounting 008004 (0201m) component
Minimum defective rate: <1dpm placement defective rate
Minimum pressure: minimum 0.3N programmable fully closed-loop placement pressure control
