Sony F130AI fully automatic high-speed placement machine
Equipment model: SI-F130AI
Equipment origin: Japan
Placement speed: 36000CPH/h
Placement accuracy: ±30μm@μ
Component size: 0201~18mm
Component thickness: Max: 8mm
PCB size: 50mm*50mm-360mm*1200mm
PCB thickness: 0.5mm to 2.6mm
Vision system: Flying high-definition vision recognition system
Placement head: 45-degree rotating head with 12 nozzles
Number of feeders: 48 front/48 rear
Machine size: 1220mm*1400mm*1545mm
Machine weight: 1560KG
Using voltage: AC 3-phase 200v 50/60HZ
Using power: 5.0KVA
Using air pressure: 0.49MPA 0.5L/min
Usage environment: ambient temperature 15℃~30℃C ambient humidity 30%~70%
Working noise: 35-50 dB
Calibration method: machine vision system multi-point MARK visual calibration
Drive system: AC servo, AC motor
Data transmission: 3.5-inch floppy disk/USB interface input
Operating system: Chinese, English, Japanese operation interface
Control mode: fully automatic