universal pick and place machine Fuzion

‌ Specifications for the Universal Instruments Universal Fuzion Chip Mounter are as follows:

‌ Placement Accuracy and Speed:

‌ Placement Accuracy: ±10 micron maximum accuracy, < 3 micron repeatability.

‌ Placement Speed: Up to 30K cph (30,000 wafers per hour) for surface mount applications and up to 10K cph (10,000 wafers per hour) for advanced packaging.

‌ Processing Capability and Scope of Application:

‌ Chip Type: Supports a wide range of chips, flip chips, and a full range of wafer sizes up to 300 mm.

‌ Substrate Type: Can place on any substrate, including film, flex, and large boards.

‌ Feeder Type: A variety of feeders can be used, including high-speed wafer feeders.

‌ Technical Features and Functions:

‌ High-Precision Servo Driven Pick Heads: 14 high-precision (sub-micron X, Y, Z) servo-driven pick heads.

‌Vision Alignment‌: 100% pre-pick vision and die alignment‌.

‌One-step switching‌: One-step wafer-to-mount switching‌.

‌High-speed processing‌: Dual wafer platforms with up to 16K wafers per hour (flip chip) and 14,400 wafers per hour (no flip chip).

‌Large size processing‌: Maximum substrate processing size is 635mm x 610mm, and the maximum wafer size is 300mm (12 inches).

‌Versatility‌: Supports up to 52 types of chips, automatic tool change (nozzle and ejector pins), and sizes ranging from 0.1mm x 0.1mm to 70mm x 70mm.

These specifications demonstrate the superior performance of the Universal Fuzion die mounter in terms of accuracy, speed and processing power, suitable for a variety of chip and substrate types, and with high flexibility and versatility