MIRTEC 2D AOI MV-6e is a powerful automatic optical inspection equipment, which is widely used in various electronic manufacturing processes, especially in the inspection of PCB and electronic components.
Features High-resolution camera: The MV-6e is equipped with a 15-megapixel high-resolution camera, which can provide high-precision 2D image inspection. Multi-directional inspection: The equipment adopts six-segment color lighting to provide more accurate inspection. In addition, it also supports Side-Viewer multi-directional inspection (optional). Defect detection: It can detect a variety of defects such as missing parts, offset, tombstone, side, too much tin, too little tin, height, IC pin cold soldering, part warping, BGA warping, etc. Remote control: Through the Intellisys connection system, remote control and defect prevention can be achieved, reducing manpower loss and improving efficiency. Technical parameters
Size: 1080mm x 1470mm x 1560mm (length x width x height)
PCB size: 50mm x 50mm ~ 480mm x 460mm
Maximum component height: 5mm
Height accuracy: ±3um
2D inspection items: missing parts, offset, skew, monument, sideways, flipped parts, reverse, wrong parts, damage, tinning, cold soldering, voids, OCR
3D inspection items: dropped parts, height, position, too much tin, too little tin, leaking solder, double chip, size, IC foot cold soldering, foreign matter, parts warping, BGA warping, creeping tin inspection, etc.
Inspection speed: 2D inspection speed is 0.30 seconds/FOV, 3D inspection speed is 0.80 seconds/FOV
Application scenarios
MIRTEC 2D AOI MV-6e is widely used in the inspection of PCB and electronic components, especially for the inspection of missing parts, offset, tombstone, sideways, excessive tin, insufficient tin, height, IC pin cold soldering, parts warping, BGA warping and other defects. Its high precision and high efficiency make it an indispensable inspection tool in the electronic manufacturing process.