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The TR7700SIII is an innovative 3D automatic optical inspection machine (AOI) that uses ultra-high-speed hybrid PCB inspection methods and optical and blue laser 3D true profile measurement technology to maximize coverage of automated inspection defects. The device combines the most advanced software solutions and the third-generation intelligent hardware platform to provide stable and powerful 3D solder joint and component defect detection, with the advantages of high detection coverage and easy programming.
Technical specifications and performance parameters
Inspection capabilities : TR7700SIII supports high-speed 2D+3D inspection and can detect 01005 components.
Inspection speed : 2D inspection speed is 60 cm²/sec at 10µm resolution; 2D inspection speed is 120 cm²/sec at 15µm resolution; and 27-39 cm²/sec in 2D+3D mode.
Optical system : Dynamic imaging technology, true 3D profile measurement, and multi-phase RGB+W LED lighting.
3D technology: Equipped with single/dual 3D laser sensors, the maximum 3D range is 20mm.
Advantages and application scenarios
High defect coverage: Adopts hybrid 2D+3D detection technology, which can provide high defect coverage.
Real 3D contour measurement technology: Adopts dual laser units to provide more accurate measurement.
Intelligent programming interface: With automated database and offline programming functions, it simplifies the programming process.
User evaluation and market positioning
The TR7700SIII 3D AOI is well-known in the market for its high performance and high coverage, and is suitable for electronic manufacturing companies that require high-precision detection. Its innovative 3D detection technology and simple programming functions give it a significant advantage in the field of automated detection
