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The main features of the GSM2 include high flexibility and high speed placement operations, as well as the ability to process multiple components simultaneously. Its core component, the FlexJet Head, ...
The Universal Instruments FuzionOF Chip Mounter is a high-performance automated chip mounter that is particularly suitable for handling large-area and heavy-weight substrates and complex, special-shap...
The REHM reflow oven VisionXS is a high-performance reflow soldering system, especially suitable for electronic manufacturing environments that meet the needs of flexibility and high production capac...
REHM reflow oven VisionXP (VisionXP+) is a “super-class” reflow soldering system with a special focus on energy efficiency, reduced emissions and lower operating costs. The system is equipped with a...
The REHM reflow oven VisionXC is a reflow soldering system designed for small and medium batch production, laboratories or demonstration production lines. Its compact design brings together all import...
REHM reflow oven Vision TripleX is a three-in-one system solution launched by Rehm Thermal Systems GmbH, designed to provide efficient and resource-saving soldering solutions. The core of Vision T...
iFlex T4, T2, H1 SMT machines adhere to the industry's most flexible "one machine for multiple uses" concept, which can be operated on a single track or on two tracks. The machine con...
Philips iFlex T2 is an innovative, intelligent and flexible surface mount technology (SMT) solution launched by Assembléon. iFlex T2 represents the latest technological advancement in the electroni...
Hitachi TCM-X200 is a high-speed placement machine with high automation and placement accuracy.
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