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It is a wire bonding machine designed for high-end IC customers, with the following features and advantages:
High precision: Eagle AERO wire bonding machine adopts advanced optical positioning technology and high-precision motion control system, which can achieve high-precision wire bonding process.
Multi-function: Suitable for a variety of package types, including QFN, DFN, TQFP, LQFP packaging, as well as optical module COC, COB packaging, to meet the wire bonding requirements of different package types.
High efficiency: With high-speed movement and fast wire change functions, it can greatly improve production efficiency.
Easy to operate: With a user-friendly operation interface and intelligent control system, the operation is simple and easy to learn.
Application field
Eagle AERO wire bonding machine is mainly used in the wire bonding process in semiconductor packaging and testing production, which can improve production efficiency and product quality, and ensure the reliability and performance of packaged products
