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ASM Wire Bonding Machine AB550 is a high-performance ultrasonic wire bonding machine with many advanced functions and features.
Features
High-speed wire bonding capability: AB550 wire bonding machine has high-speed wire bonding capability and can weld 9 wires per second.
Micro-pitch welding capability: This equipment has micro-pitch welding capability, with a minimum soldering position size of 63 µm x 80 µm and a minimum soldering position spacing of 68 µm.
New workbench design: The workbench design makes welding faster, more accurate and more stable.
Extra large welding range: A wide range of effective welding wires, suitable for a variety of product applications, improving production efficiency.
"Zero" maintenance design: The design reduces maintenance requirements and reduces production costs.
Image recognition technology: Patented image recognition technology increases production capacity.
Application areas and advantages
AB550 wire bonding machine is widely used in the field of semiconductor packaging and is especially suitable for production environments that require high precision and efficiency. Its high-speed wire bonding and micro-pitch welding capabilities give it significant advantages in electronic manufacturing and can significantly improve production efficiency and product quality. In addition, its extra large welding range and "zero" maintenance design further enhance its application value in industrial production
