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DISCO DFD6341 fully automatic dicing machine is mainly used for semiconductor processing. The DFD6341 dicing machine adopts a new axis mechanism, which increases the return speed of the X axis to 1,000mm/sec, and improves the acceleration and deceleration performance of each axis. The moving range at the highest speed is increased, thereby greatly improving the production efficiency. In addition, the parts used are improved, the handling speed of the main handling mechanism is increased, and the distance between the spindles is shortened, which can shorten the processing time during double-blade cutting. The DFD6341 dicing machine is suitable for large-scale production. It is efficient and precise, and can meet the needs of high production efficiency and high-quality processing.
Equipment size: 1.180 meters wide, 1.080 meters deep, 1.820 meters high. Equipment weight: about 1.500 kilograms. Maximum processing object size: Φ8 inches (about 200 mm). Spindle configuration: opposing dual spindles. Rated power: 1.2 kW and 2.2 kW. Cutting speed: 0.1 to 1,000 mm/sec. X-axis cutting range: 210 mm. Y-axis cutting range: 210 mm. Z-axis maximum travel: 19.22 mm (for Φ2-inch blades) and 19.9 mm (for Φ3-inch blades). Technical parameters and performance characteristics X-axis return speed: 1,000 mm/sec. Positioning accuracy: 0.002 mm within a range of 210 mm. High-speed flash calibration: Equipped with a xenon flash lamp and a high-speed shutter CCD, it can achieve calibration during high-speed movement, reduce calibration time, and improve production efficiency.
Easy to operate: It uses a graphical user interface (GUI) and an LCD touch screen for convenient operation.
Application scenarios and advantages
DISCO DFD6341 fully automatic dicing machine is suitable for high-precision cutting needs in semiconductor manufacturing. Its high production efficiency and space-saving design give it significant advantages in the field of semiconductor manufacturing. By optimizing components and increasing the speed of the main handling part, the processing time of dual-axis cutting is reduced, further improving production efficiency.
