DISCO wafer cutting machine DFL7341

DISCO wafer cutting machine: The DFL7341 laser invisible cutting machine focuses an infrared laser with a wavelength of about 1300nm inside the silicon wafer to produce a modified layer, and then divides the wafer into grains by expanding the film and other methods to achieve low damage, high precision, and high quality cutting effects. This method only forms a modified layer inside the silicon wafer, suppresses the generation of processing debris, and is suitable for samples with high particle requirements.

‌High precision and high efficiency‌: The DFL7341 adopts dry processing technology, does not require cleaning, and is suitable for processing objects with poor load resistance. The width of its cutting groove can be very narrow, which helps to reduce the cutting path. The working disk has high precision, the X-axis linear accuracy is ≤0.002mm/210mm, the Y-axis linear accuracy is ≤0.003mm/210mm, and the Z-axis positioning accuracy is ≤0.001mm. The cutting speed range is 1-1000 mm/s, and the dimensional resolution is 0.1 micron.

‌Scope of application‌: The equipment is mainly used to cut silicon wafers with a maximum size of no more than 8 inches. Suitable for cutting pure silicon wafers with a thickness of 0.1-0.7mm and a grain size greater than 0.5mm. The dicing marks after cutting are about a few microns, and there is no edge collapse or melting damage on the surface and back of the wafer.

‌Technical parameters‌: The DFL7341 laser invisible cutting system includes a cassette lift, a conveyor, an alignment system, a processing system, an operating system, a status indicator, a laser engine, a chiller and other parts. The X-axis cutting speed is 1-1000 mm/s, the Y-axis dimensional resolution is 0.1 micron, and the moving speed is 200 mm/s; the Z-axis dimensional resolution is 0.1 micron, and the moving speed is 50 mm/s; the Q-axis adjustable range is 380 degrees.

‌Application scenarios‌: DFL7341 is suitable for the semiconductor industry, especially in the chip packaging process, which can ensure the accuracy and stability of chip packaging, maximize the performance potential of the chip, and improve production efficiency. ‌ In summary, the DISCO cutting machine DFL7341 plays an important role in the semiconductor and electronics industries. Through its high-precision and high-efficiency cutting technology, it ensures the quality and production efficiency of products.