‌ASM Laser Cutting Machine LS100-2‌

‌ASM Laser Cutting Machine LS100-2‌ is a laser dicing machine specially designed for high-precision cutting needs, especially suitable for the manufacturing of Mini/Micro LED chips. The device has the following main features and advantages:

‌High-precision cutting‌: The cutting depth accuracy of LS100-2 is σ≤1um, the XY cutting position accuracy is σ≤0.7um, and the cutting path width is ≤14um. These parameters ensure the high accuracy of chip cutting‌.

‌Efficient production‌: This equipment can cut approximately 10 million chips per hour, significantly improving production efficiency‌.

‌Patented technology‌: LS100-2 adopts a number of patented technologies to further improve the stability and reliability of cutting‌.

‌Scope of application‌: Suitable for 4" and 6" wafers, the wafer thickness changes less than 15um, the workbench size is 168mm, 260mm and 290°, which can meet the cutting needs of different sizes and thicknesses‌.

In addition, the LS100-2 laser dicing machine is of great significance in Mini/Micro LED chip manufacturing. Since Mini/Micro LED chips require extremely high cutting accuracy, it is difficult for ordinary equipment to ensure yield and output at the same time. LS100-2 solves this problem through its high precision and high efficiency, meeting the industry’s demand for both yield and output‌