disco wafer cutting machine DAD3241

‌DISCO-DAD3241 is a high-performance automatic slicer suitable for cutting needs of various materials with high productivity and high precision. ‌

Main Features and Technical Specifications ‌High Productivity‌: DAD3241 adopts servo motor driven X, Y, and Z axes, which increases the axis speed and thus improves the production capacity. The standard Y-axis grating scale improves the jump accuracy‌. ‌High Precision‌: Through the non-contact height measurement (NCS) function, the measurement accuracy is improved and the measurement time is shortened, which is suitable for high-precision processing needs‌. ‌Wide Application Range‌: Suitable for difficult-to-cut materials such as silicon wafers and ceramics, and can correspond to workpieces with a maximum diameter of 8 inches‌. ‌Space-saving Design‌: The machine width is only 650 mm, suitable for compact working environments‌. ‌Easy to operate and maintain‌: Equipped with a microscope lens shading plate and air blowing cleaning device, the maintenance frequency is reduced and the equipment operation efficiency is improved‌. ‌Operation Interface and Functions ‌XIS System‌: The operation buttons are concentrated on the microscope page for easy operation‌. ‌Wafer Mapping‌: Graphically display the cutting progress status‌. ‌Log Viewer‌: Display analog data in graphs and visualize cutting parameters‌