DISCO DAD323 is a high-performance automatic dicing machine suitable for diversified processing from semiconductor wafers to electronic components.
Main features and functions Processing capacity: DAD323 can handle processing objects up to 6 inches square, equipped with a high-torque 2.0 kW spindle, suitable for processing difficult-to-cut materials such as glass and ceramics. In addition, you can also choose to install a high-speed 1.8 kW spindle (maximum number of revolutions: 60,000 min-1), which is highly versatile. Precision and efficiency: The use of a high-performance MCU improves the software operation speed and operation response speed, achieving high-speed X, Y, and Z axes and improved production efficiency. The X-axis homing speed is 800mm/s, which is 1.6 times that of previous models. Ease of operation: Equipped with a 15-inch screen and GUI (Graphical User Interface), the large-scale operation interface improves recognition and increases the amount of information. The automatic calibration function is standard, and the operator only needs to press the start button, and the machine can cut the cutting path identified in the position calibration process.
Design features: DAD323 adopts a compact design, occupies a small area, and is only 490 mm wide. It is particularly suitable for running several cutting machines in parallel to improve the production efficiency per unit area.
Applicable scenarios and user evaluations
DAD323 is suitable for diversified processing from semiconductor wafers to electronic components, and can meet various processing requirements. Users commented that it is easy to operate, high in precision and high in efficiency, and is particularly suitable for production environments that require high space efficiency.